Active Member
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[China]
Contact name:Vicky Lee
Huaswin Electronics Co.,Limited |
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10 Layer FR4 Circuit Board Assembly / SMT and Through Hole
PCB Assembly
Specifications:
| Layer: 10 Layer | Mini Hole: 0.2mm |
| Material: FR4 | Mini Width/space: 4mil/4mil |
| Thickness: 2.0mm | Testing points:4000 |
| Copper thickness: 1oz | Solder Mask: LPI Green |
| Finish: Immersion Gold | Silkscreen: White |
| Function: Controller | Components: 10 IC chips, 2 Crystals, 5 Transistors |
Detailed Specification of PCB Manufacturing
1 | layer | 1-30 layer |
2 | Material | CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, |
3 | Board thickness | 0.2mm-6mm |
4 | Max.finished board size | 800*508mm |
5 | Min.drilled hole size | 0.25mm |
6 | min.line width | 0.075mm(3mil) |
7 | min.line spacing | 0.075mm(3mil) |
8 | Surface finish | HAL, HAL Lead free,Immersion Gold/ Silver/Tin, |
9 | Copper thickness | 0.5-4.0oz |
10 | Solder mask color | green/black/white/red/blue/yellow |
11 | Inner packing | Vacuum packing,Plastic bag |
12 | Outer packing | standard carton packing |
13 | Hole tolerance | PTH:±0.076,NTPH:±0.05 |
14 | Certificate | UL,ISO9001,ISO14001,ROHS,TS16949 |
15 | Profiling punching | Routing,V-CUT,Beveling |
Detailed Specification of Pcb Assembly
1 | Type of Assembly | SMT and Thru-hole |
2 | Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free |
3 | Components | Passives Down to 0201 Size |
BGA and VFBGA | ||
Leadless Chip Carries/CSP | ||
Double-Sided SMT Assembly | ||
Fine Pitch to 08 Mils | ||
BGA Repair and Reball | ||
Part Removal and Replacement-Same Day Service | ||
3 | Bare Board Size | Smallest:0.25x0.25 Inches |
Largest:20x20 Inches | ||
4 | File Formats | Bill of Materials |
Gerber Files | ||
Pick-N-Place File(XYRS) | ||
5 | Type of Service | Turn-Key,Partial Turn-Key or Consignment |
6 | Component Packaging | Cut Tape |
Tube | ||
Reels | ||
Loose Parts | ||
7 | Turn Time | 15 to 20 days |
8 | Testing | AOI inspection |
X-Ray inspection | ||
In-Circuit testing | ||
Functional test |
Quality Assurance:
Our Quality processes include:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004
Certificates:
ISO9001-2008
ISO/TS16949
UL
IPC-A-600G and IPC-A-610E Class II compliance
Customer's requirements
