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PCB Fabrication Service PCB Board Assembly For Driver / LED Controller

Huaswin Electronics Co.,Limited
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Contact name:Vicky Lee

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Huaswin Electronics Co.,Limited

PCB Fabrication Service PCB Board Assembly For Driver / LED Controller

Country/Region china
Categories Solar Chargers
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Product Details

 

PCB Fabrication Service PCB Board Assembly For Driver / LED Controller

 

 

PCB Assembly services: 

 

SMT Assembly 
Automatic Pick & Place 
Component Placement as Small as 0201 
Fine Pitch QEP - BGA 
Automatic Optical Inspection

 


Through-hole Assembly 


Wave Soldering 
Hand Assembly and Soldering

Material Sourcing 
IC pre-programming / Burning on-line

Function testing as requested

Aging test for LED and Power boards

Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc) 
Packing design

 

 

Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is

applied onto the printed circuit board assembly to protect the electronic assembly from damage due to

contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.

 When coated, it is clearly visible as a clear and shiny material.


Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,

plastics, casings and print & packaging material

 

Testing Methods

AOI Testing
·Checks for solder paste 
·Checks for components down to 0201" 
·Checks for missing components, offset, incorrect parts, polarity

X-Ray Inspection
X-Ray provides high-resolution inspection of: 
·BGAs 
·Bare boards 

In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by

component problems. 
· Power-up Test
· Advanced Function Test
· Flash Device Programming
· Functional testing

 

 

Detailed Specification of Pcb Assembly

 

1

Type of Assembly

SMT and Thru-hole

2

Solder Type

Water Soluble Solder Paste,Leaded and Lead-Free

3

Components

Passives Down to 0201 Size

BGA and VFBGA

Leadless Chip Carries/CSP

Double-Sided SMT Assembly

Fine Pitch to 08 Mils

BGA Repair and Reball

Part Removal and Replacement-Same Day Service

3

Bare Board Size

Smallest:0.25x0.25 Inches

Largest:20x20 Inches

4

File Formats

Bill of Materials

Gerber Files

Pick-N-Place File(XYRS)

5

Type of Service

Turn-Key,Partial Turn-Key or Consignment

6

Component Packaging

Cut Tape

Tube

Reels

Loose Parts

7

Turn Time

15 to 20 days

8

Testing

AOI inspection

X-Ray inspection

In-Circuit testing

Functional test

 

 

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