High Frequency Electronic Pcb Assembly Circuit Board Manufacturer
Welcome to Huaswin!
Huaswin Electronics is a professional PCB & PCB Assembly manufacturer, located in Shenzhen, China.
We supply one-stop facility services: PCB design, PCB fabrication, components procurement, SMT and DIP
assembly ,IC pre-programming / burning on-line, testing, packing.
- Technical requirement:
- Professional surface-mounting and through-hole soldering technology
- Various sizes are available, like 1206, 0805, 0603 components SMT
technology
- ICT (in circuit test), FCT (functional circuit test) technology
- PCB assembly with UL, CE, FCC and RoHS approvals
- Nitrogen gas reflow soldering technology for SMT
- High standard SMT and solder assembly line
- High density interconnected board placement technology capacity
- Quote requirement:
- Gerber file of the bare PCB board
- BOM (bill of material) for assembly
- To short the lead time, please kindly advise us if there is any
acceptable components substitution
- Testing guide and test fixtures if necessary
- Programming files and programming tool if necessary
- Schematic if necessary
- OEM/ODM/EMS services for PCBA:
- PCBA, PCB assembly: SMT, PTH and BGA
- PCBA and enclosure design
- Components sourcing and purchasing
- Quick prototyping
- Plastic injection molding
- Metal sheet stamping
- Final assembly
- Test: AOI, in-circuit test (ICT), functional test (FCT)
- Custom clearance for material importing and product exporting
- Orientronic PCB assembly equipmet
- Fully automatic SMT stencil printer: FolunGwin Win-5
- SMT machine: Siemens SIPLACE D1/D2/Siemens SIPLACE S20/F4
- Reflow oven: FolunGwin FL-RX860
- Wave soldering machine: FolunGwin ADS300
- Automated optical inspection (AOI): Aleader ALD-H-350B
- Needed:
- PCB gerber file
- BOM list for PCB assembly
- Send us your sample PCB board or PCBA
- Advantages:
- Turnkey manufacturing or quick-turn prototypes
- Board-level assembly or complete system integration
- Low-volume or mixed-technology assembly for PCBA
- Even consignment production
- Supported capabilities
- Type of assembly:
- THD (thru-hole device)/conventional
- SMT (surface-mount technology)
- SMT and THD mixed
- Double-sided SMT and/or THD assembly
- Components:
- Passives, smallest size 0201
- Fine pitch to 08 Mils
- Leadless chip carriers/BGA, VFBGA, FPGA and DFN
- Connectors and terminals
- Component packaging:
- Reels
- Cut tape
- Tube
- Loose parts
- Board dimensions:
- Smallest size: 0.25 x 0.25 inch/6 x 6mm
- Largest size: 15.75 x 13.5 inches/400 x 340mm
- Board shape:
- Rectangular
- Round
- Slots
- Cutouts
- Complex
- Irregular
- Board type:
- Rigid
- Flexible
- Rigid-flexible
- Solder type:
- Leaded and lead-free
- Water soluble solder paste
- Manual soldering for special parts, such as wires and temperature
sensitive parts
- Design file format:
- Gerber RS-274X, 274D, Eagle and AutoCAD’s DXF, DWG
- BOM (bill of materials)
- Pick and place file (XYRS)
