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Double Sided FPC Circuit Flexible PCB Multilayer Membrane Switch

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Contact name:Vicky Lee

Huaswin Electronics Co.,Limited

Double Sided FPC Circuit Flexible PCB Multilayer Membrane Switch

Country/Region	china
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Product Details

Double Side FPC Circuit Electric Flexible Multilayer Board Screen Printing Membrane Switch

FPC Circuit Electric Flexible Multilayer Board Screen Printing Membrane Switch

Flexible Printed Circuit:
We are a company for the production processing with system integrity, and stable technical personnel fluctuation, besides we can provide one-station service
1. Layers:
Overlay, Overlay adhesive, Dome retainer, Metal dome, Spacer adhesive, Circuit, Rear adhesive (as customers request)

2. Production Capacity:
Screen Print Department, IR Tunnel, Thickness Tester, IR Oven, Laser Cutting Machine, Punching Department, Emboss Key Section, Assemble, Electric Testing, OQC Department, Virtual Aspect Testing, Punch Machine Department, PU Coating Section,

3. Technical Parameters:
Wire Resistance: ≤ 1 Ohm/cm
Current Rating: 25-100mA, 0-30V DC
Work Voltage: ≤ 50V DC
Insulation Voltage: ≤ 100M Ohm 250V DC
Working Life: ≤ One Million Times
Work Temperature: -40 Centigrade-70 Centigrade
Work Humidity: 40 Centigrade-≤ 98%RH
Basic Material Pressurization: 1500V DC
Please do contact me for more information, let's talk details!

Why choose us?

1 High reliable in function with Low cost
2 Function test 100% before shipment Rosh
3 Three factories to support mass production
4 Professional staffs and in administration level
5 Expert sales team to support customer services.
6 Metal dome or silicone keypad is also available.
7 Waterproof seal & design reach IP65.
8 15 years rich experiences in cooperation with famous brands such as SANYO/Philips /Siemens /Mettel etc.

Insulation Resistance	<100MΩ,250V DC	Contact resistance	<1Ω /cm
operating voltage	≤ 50VDC	working current	25- 100mA,0-30V DC
reliability/service life	>1 million times/Withstand millions of cycles	Operating humidity	when40°C,<98%RH
spring time	≤ 5ms	substrate voltage	2000V DC
Tail flexiblility	any angle within 180 degree	Switch travel	Flat Type 0.05-0.3mm tactile type:0.3-1.5mm

Detailed Specification of Flexible PCB Manufacturing

Technical Specification
Layers:	1~10 (flex Pcb) and 2~8 (rigid flex)
Min Panel Size:	5mm x 8mm
Max Panel Size:	250 x 520mm
Min Finished board thickness:	0.05mm (1 sided inclusive copper)
Max Finished board thickness:	0.3mm (2 sided inclusive copper)
Finished board thickness tolerance:	±0.02~0.03mm
Material:	Kapton, Polyimide, PET
Base copper thickness (RA or ED):	1/3 oz, 1/2 oz, 1oz, 2oz
Base PI thickness:	0.5mil, 0.7mil, 0.8mil, 1mil, 2mil
Stiffner:	Polyimide, PET, FR4, SUS
Min Finished hole diameter:	Φ 0.15mm
Max Finished hole diameter:	Φ 6.30mm
Finished hole diameter tolerance (PTH):	±2 mil ( ±0.050mm)
Finished hole diameter tolerance (NPTH):	±1 mil ( ±0.025mm)
Min width/spacing (1/3oz):	0.05mm/0.06mm
Min width/spacing (1/2oz):	0.06mm/0.07mm
Min width/spacing (1oz):	Single layer: 0.07mm/0.08mm
Min width/spacing (1oz):	Double layer: 0.08mm/0.09mm
Aspect Ratio	6:01	8:01
Base Copper	1/3Oz--2Oz	3 Oz for Prototype
Size Tolerance	Conductor Width:±10%	W ≤0.5mm
	Hole Size: ±0.05mm	H ≤1.5mm
	Hole Registration: ±0.050mm
	Outline Tolerance:±0.075mm	L ≤50mm
Surface Treatment	ENIG: 0.025um - 3um
	OSP:
	Immersion Tin: 0.04-1.5um
Dielectric Strength	AC500V
Solder Float	288℃/10s	IPC Standard
Peeling Strength	1.0kgf/cm	IPC-TM-650
Flammability	94V-O	UL

PCB Assembly services:

SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection
Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering
Material Sourcing
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design

Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
plastics, casings and print & packaging material

Testing Methods
AOI Testing
· Checks for solder paste
· Checks for components down to 0201"
· Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
· BGAs
· Bare boards
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by
component problems.
· Power-up Test
· Advanced Function Test
· Flash Device Programming
· Functional testing

Detailed Specification of Pcb Assembly

1	Type of Assembly	SMT and Thru-hole
2	Solder Type	Water Soluble Solder Paste,Leaded and Lead-Free
3	Components	Passives Down to 0201 Size
		BGA and VFBGA
		Leadless Chip Carries/CSP
		Double-Sided SMT Assembly
		Fine Pitch to 08 Mils
		BGA Repair and Reball
		Part Removal and Replacement-Same Day Service
3	Bare Board Size	Smallest:0.25x0.25 Inches
3	Bare Board Size	Largest:20x20 Inches
4	File Formats	Bill of Materials
		Gerber Files
		Pick-N-Place File(XYRS)
5	Type of Service	Turn-Key,Partial Turn-Key or Consignment
6	Component Packaging	Cut Tape
		Tube
		Reels
		Loose Parts
7	Turn Time	15 to 20 days
8	Testing	AOI inspection
		X-Ray inspection
		In-Circuit testing
		Functional test