Shenzhen Through Hole PCB Assembly Lead Free HASL White Silkscreen With ICT Testing

Shenzhen Through Hole PCB Assembly Lead Free HASLThickness1.6mm Green Solder Mask White Silkscreen With ICT Testing
 

 

 

 

 

Huaswin specialized in PCB manufacturing and and PCB Assembly
 
PCBA capabilities: 

1. Fast prototyping
2. High mix, low and medium volume build
3. SMT MinChip:0201
4. BGA: 1.0 to 3.0 mm pitch
5. Through-hole assembly
6. Special processes (such as conformal coating and potting)
7. ROHS capability
8. IPC-A-610E and IPC/EIA-STD workmanship operation

 
 
Detailed Specification of PCB Manufacturing
 

 
 
PCB Assembly services: 
 
SMT Assembly 
Automatic Pick & Place 
Component Placement as Small as 0201 
Fine Pitch QEP - BGA 
Automatic Optical Inspection 
 
Through-hole Assembly 
Wave Soldering 
Hand Assembly and Soldering 
Material Sourcing 
IC pre-programming / Burning on-line 
Function testing as requested 
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc) 
Packing design
 
 
Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is 
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to 
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
 When coated, it is clearly visible as a clear and shiny material.
 
 
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts, 
plastics, casings and print & packaging material
 
 
Testing Methods
AOI Testing
Checks for solder paste 
Checks for components down to 0201" 
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of: 
BGAs 
Bare boards 
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by 
component problems. 
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing
 
 
Quality Processes: 
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process 
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949
 
 
Design file format:
 
1. Gerber RS-274X, 274D, Eagle and AutoCAD's DXF, DWG
2. BOM (bill of materials)
3. Pick and place file (XYRS)
 
Advantages:
 
1. Turnkey manufacturing or quick-turn prototypes
2. Board-level assembly or complete system integration
3. Low-volume or mixed-technology assembly for PCBA
4. Even consignment production
5. Supoorted capabilities