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ASM NANO PCB SMT Machine Die Bonder And Flip Chip Bonder Machine
ASM NANO Die Bonder and Flip Chip Bonder, Original and Used Die Bonder and Flip Chip Bonder Machine
Infinite Automation is the best choice if you are looking for dependable Factory Automation Machines and Production Equipment. Among Our offered machines are original and pre-owned Die Bonding and Die Attach, Wire Bonding, Die Bonder and Flip Chip Bonder Machines. Infinite Automation has a big quantity of stock for Semiconductor related equipment. Among our featured machines are original and used ASM NANO Die Bonder and Flip Chip Bonder.
Infinite Automation has more than 200 hundred units of Die Bonding and Die Attach, and Wire Bonding machines available. Infinite Automation is a trusted China supplier of best-conditioned pre-owned factory automation machines and production line equipment. Contact our Sales and Customer Support Team for inquiries.
ASM NANO Die Bonder and Flip Chip Bonder
Dimensions
W x D x H
1690 x 1430 x 2040 mm
The NANO Die Bonder / Flip Chip Bonder is designed for the following markets:
NANO is an ultra-precision die and flip-chip bonder for highly
demanding assembly tasks billed as the highest-precision placement
system in its class. Aiming at today’s, and future placement
demands, NANO enables the reliable handling of ultra-small and very
thin die.
ASM AMICRA‘s die bonding technology was specifically designed to
serve the photonic assembly market by providing the ultimate
placement accuracy while supporting a high-speed AuSn eutectic
bonding process. ASM AMICRA has been perfecting this technology for
almost 20 years, developing high-resolution imaging systems to
support the dynamic alignment system, implementing a fiber laser to
be used as the primary heat source for AuSn eutectic bonding,
high-resolution motion control systems mounted on a granite
structure with a special vibration damping system. The principle
design of this vision-driven die bonder is to mount all 4x imaging
systems in fixed positions, mounted to granite, while all other
motion control systems move around the vision cameras. This
fundamental design concept produces the highest precision placement
accuracy die bonder in the industry today.