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Turnkey PCB Assembly Prototype , 2.2mm Rigid Flex PCB Assembly

Beijing Haina Lean Technology Co., Ltd
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Address: Room 704-3, 7 / F, Building 9, Yard 8, Development Road, Changping District, Beijing

Contact name:Marina

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Beijing Haina Lean Technology Co., Ltd

Turnkey PCB Assembly Prototype , 2.2mm Rigid Flex PCB Assembly

Country/Region china
City & Province beijing beijing
Categories Electronics Production Machinery
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Product Details

2.2mm Thickness Rigid-Flex Turnkey Circuit Board PCB Assembly Prototype

 

PCB Assembly Prototype Introduction

 

Prototype printed circuit board (PCB) assemblies also named surface-mount technology (SMT) PCB prototypes, PCBA prototype assembly, PCB sample assembly, etc.

The term prototype PCB Assembly refers to a fast prototype PCBA used to test the function of new electronic designs.

The prototype PCB assembly section of our manufacturing facility has a unique layout that allows for flexible use of both automated and manual parts-loading stations.

Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs .

 

PCB CAPABILITIES 

 

Base materialFR4,High-TG FR4,CEM3,aluminum, High frequency(Rogers,Taconic,Aron,PTFE,)
Layers1-46
Copper Thickness0.3oz,0.5oz, 1oz, 2oz, 3oz,4oz,5oz, 6oz
Dielectric Thickness0.05mm, 0.075mm, 0.1mm,0.15mm,0.2mm
board Core Thickness0.4mm,0.6mm, 0.8mm, 1.0mm, 1.2mm,
1.5mm, 2.0mm, 3.0mm and 3.2mm
Board Thickness0.3mm - 4.0mm
Thickness Tolerance+/-10%
Surface FinishingHASL lead free,ENIG,Plated Gold,Immersion Gold,OSP
Solder Mask ColorGreen, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue
Legend ColorBlack, White etc
Assembly TypesSurface mount
Thro-hole
Mixed technology (SMT & Thru-hole)
Single or double sided placement
Conformal coating
Shield cover assembly for EMI emission control
Parts ProcurementFull Turnkey, Partial Turnkey, Kitted / Consigned
Component typesSMT 01005 or larger
BGA 0.4mm pitch, POP (Package on Package)
WLCSP 0.35mm pitch
Hard metric connectors
Cable & wire
Other TechniquesFree DFM Review
Box Build Assembly
100% AOI test and X-ray test for BGA
Components cost-down
Function test as custom
Protection technology

 

PCBA CAPABILITIES

 

PCBA Capability
Material TypeItemMinMax
PCBDimension (length,width,height.mm)50*40*0.38600*400*4.2
MaterialFR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC
Surface finishHASL,OSP,Immersion gold,Flash Gold Finger
ComponentsChip&IC100555mm
BGA Pitch0.3mm-
QFP Pitch0.3mm-

 

Our advantage

 

Service value

Independent quotation system to quickly serve the market

 

PCB manufacturing

High-tech PCB and PCB assembly production line

 

Material purchasing

A team of experienced electronic component procurement engineers

 

SMT post soldering

Dust-free workshop, high-end SMT patch processing

 

 

 

Delivery Time 

 

Product TypeQtyNormal lead timeQuick-turn lead time
SMT+DIP1-501WD-2WD8H
SMT+DIP51-2002WD-3WD1.5WD
SMT+DIP201-20003WD-4WD2WD
SMT+DIP≥20014WD-5WD3WD
PCBA(2-4Layer)1-502.5WD-3.5WD1WD
PCBA(2-4Layer)51-20005WD-6WD2.5WD
PCBA(2-4Layer)≥2001≥7WD5WD
PCBA(6-10Layer)1-503WD-4WD2.5WD
PCBA(6-10Layer)51-20007WD-8WD6WD
PCBA(10-HDILayer)1-507WD-9WD5WD
PCBA(10-HDILayer)51-20009WD-11WD7WD

 

PCBA Prototype Application Field 

 

Our products are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics.

 

 

Workshop

 

 

Common packaging


PCB: Vacuum packaging with carton box
PCBA: ESD packaging with carton box

 

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