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High Volume Fast Ems Pcb Assembly Prototyping Service Home Medical PCBA

Quanhong FASTPCB
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Address: Building B, Shangxing West Industrial Zone, No. 1001, West Ring Road, Shajing street, Bao'an District, Shenzhen, Guangdong, China

Contact name:Yu

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Quanhong FASTPCB

High Volume Fast Ems Pcb Assembly Prototyping Service Home Medical PCBA

Country/Region china
City & Province shenzhen guangdong
Categories Tool Processing Services
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Product Details

Home medical electronics can be divided into four categories:

I. Home health care equipment: pain massage equipment, home health self-testing equipment, sphygmomanometer, electronic thermometer, multifunctional therapeutic instrument, blood glucose meter, vision improvement equipment, sleep improvement equipment, oral health products, adult health care equipment, family emergency treatment products;

Two, family health massage products: electric massage chair/bed; Massage stick; Massage lamented. Massage pillow; Massage cushion; Massage belt; Blood circulation machine; Foot bath; Foot massager; Hand-held massager, jacuzzi, fat swinging belt; Therapeutic apparatus; Plantar therapy instrument; Weight loss belt; Car seat; Kneading mat; Massage chair; Breast enhancement; Beauty massager;

3. Family medical rehabilitation equipment: domestic cervical and lumbar vertebra tractors, traction chairs, physiotherapy instruments, sleep instruments, massage instruments, functional chairs, functional beds, support devices, medical inflatable air cushions; Oxygen generator, decocting device, hearing aid, etc.

Iv. Home care equipment: home rehabilitation nursing AIDS, women's pregnancy and baby care products, home gas supply equipment;

 

HLC Process capability

ItemHLC Advanced Technology
201920202021
Max Panel Width (inch)252525
Max Panel Length (inch)292929
Max Layer Count (L)161836
Max Board thickness (mm)3.246
Max Board thickness Tolerance+/-10%+/-10%+/-10%
Base copper ThicknessInner layer ( OZ )468
Outer Layer ( OZ )234
Min DHS ( mm )0.20.150.15
PTH Size Tolerance ( mil )+/-2+/-2+/-2
Back Drill (stub)( mil )~ 3~ 2.4~ 2
Max. AR12:116:120:1
ItemHLC Advanced Technology
201920202021
M-drill toleranceInner layer ( mil )DHS + 10DHS + 10DHS + 8
Outer Layer ( mil )DHS + 8DHS + 8DHS + 6
Solder mask Registration (um)+/- 40+/- 30+/- 25
Impedance control≥50ohms+/-10%+/-10%-/-8%
<50ohms5 Ω5 Ω4 Ω
Min LW/S (Inner)@1oz base Cu ( mil )3.0 / 3.02.6 / 2.62.5 / 2.5
Min LW/S (Outer)@1oz Cu ( mil )3.5 / 3.53.0 / 3.53.0 / 3.0
Max dimple for POFV ( um )302015
Surface FinishingENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au

HDI Process capability

ItemHDI Advanced Technology
201920202021
Structure5+n+56+n+67+n+7
HDI Stack ViaAnyLayer(12L)AnyLayer(14L)AnyLayer(16L)
Board Thickness(mm)Min. 8L0.450.40.35
Min. 10L0.550.450.4
Min. 12L0.650.60.55
MAX. 2.4 
Min. Core Thickness ( um )504040
Min. PP Thickness ( um )30(#1027PP)25(#1017PP)20(#1010PP)
Base Copper ThicknessInner Layer ( OZ)1/3 ~ 21/3 ~ 21/3 ~ 2
Outer Layer ( OZ )1/3 ~ 11/3 ~ 11/3 ~ 1
ItemHDI Advanced Technology
201920202021
Min. Mechanical Drill hole size(um) **200200150
Max. Through Hole Aspect Ratio *8:110:110:1
Min. Laser via/Pad Size ( um )75/20070/17060/150
Max. Laser Via Aspect Ratio0.8:10.8:10.8:1
Laser Via on PTH(VOP)designYesYesYes
Laser X type through hole(DT≤200um)NA60~100um60~100um
Min. LW/S (L/S/Cu, um)Inner Layer45 /45 /1540/ 40/ 1530/ 30 /15
outer Layer50 /50/ 2040 /50 /2040 /40 /17
Min BGA Pitch (mm) 0.350.30.3
ItemHDI Advanced Technology
201920202021
Solder mask Registration (um)+/- 30+/- 25+/- 20
Min. Solder Mask Dam (mm)0.070.060.05
PCB Warpage Control>= 50ohm+/-10%+/-8%+/- 5%
< 50ohm+/- 5ohm+/- 3ohm+/- 3ohm
PCB Warpage Control≤0.5%≤0.5%≤0.5%
cavity Depth accuracy (um)Mechanical+/- 75+/- 75+/- 50
Laser directly+/- 50+/- 50+/- 50
Surface FinishingOSP,ENIG,Immersion Tin,Hard Au, Immersion AgOSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG

SMT Capability

ItemSMT Capability
201920202021
Min board thickness ( mm )0.10.060.05
Max. board size ( mm )200 x 250250 x 300250 x 350
Chip component ( L, C, R etc. )Minimum size100510051005
Connector0.5 mm pitchYYY
0.4 mm pitchYYY
0.35 mm pitchYYY
High density component :0.5 mm pitchYYY
TSOP, QFP, QFN, LGA, BGA etc.0.4 mm pitchYYY
 0.35 mm pitchYYY
ReflowN2 reflowNoYY
Under-fillFill under chipManualAutoAuto
ACF attachGold finger pitchN/A0.3 mm0.2 mm
InspectionComponent position, direction, missing etc.Manual check with 10 x scopeAuto AOI inspectionAuto AOI inspection
Solder paste thicknessMeasure once per shift1 line auto full area, online SPIAll lines auto full area, online SPI

 

Packaging & Delivery
Packaging Details:Inner: vacuum packing or Anti-static package,
Outer: export carton
or according to the customer's requirement.
Port:Shenzhen or Hongkong
Lead Time:Quantity(Pieces)1-1011-100101-1000>1000
 Est. Time(days)3-53-57-9

To be negotiated

 

 

FAQ:

Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.

 

Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.

 

Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.

 

Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.

 

Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.

 

Q: Are you factory?

FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China

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