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Dual Platform 15W UV Laser Cutting Machine For Cover Film

YUSH Electronic Technology Co.,Ltd

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Dual Platform 15W UV Laser Cutting Machine For Cover Film

Country/Region china
City & Province suzhou jiangsu
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Product Details

Dual Platform 15W UV Laser Cutting Machine for Cover film, pure glue, blue film,FR4,PP,PI,FPC, PC

 

 

UV laser cutting machine-MicroScan5000DP Introduction

 

Description:

 

Work Table:The dual-platform working mode, one in and one out, always keep the equipment in contact with uninterrupted work, greatly improve production efficiency, is a tailor-made equipment for FPC and PCB processing.

 

Efficient and fast FPC/PCB profile cutting, drilling and covering film windowing, fingerprintrecognition chip cutting, TF memory card sub-board, mobile phone camera module cutting and other applications.

 

Divided, layered, designated block or selected area is cut and formed directly, the cutting edge is neat and round, smooth, without burrs, and without glue overflow. The products can be arranged in a matrix for automatic positioning and cutting, which is especially suitable for the cutting of fine, difficult, and complex patterns.

 

High-performance laser: The solid-state UV laser of the international first-line brand is used. It has the advantages of good beam quality, small focus spot, uniform power distribution, small thermal effect, small slit width, and high cutting quality, which guarantees perfect cutting quality.

 

Fast and high precision: The combination of a high-precision, low-drift galvanometer and a fast iron-core linear motor system platform can cut quickly while maintaining micron-level precision.

 

Fully automatic positioning: the use of high-precision CCD automatic positioning and focusing, making positioning fast, accurate and precise, without manual intervention, simple operation, and achieve the same type of one-key mode, greatly improving production efficiency.

 

Exhaust gas treatment system: The suction system can eliminate all cutting exhaust gas, avoiding the harm to the operator and the pollution to the environment.

 

High degree of automation: the galvanometer is automatically calibrated, automatically adjusted, and the entire process is automated. The laser displacement sensor is used to automatically adjust the focus to the height of the table to achieve fast alignment, saving time and worry.

 

Easy-to-learn software: self-developed control software based on Windows system, easy-to-operate Chinese interface, friendly and beautiful, powerful and diverse, simple and convenient to operate.

 

 

MicroScan5000DP Specification:

 

ItemDevice ModelMicroScan 5000DP

 

Laser BrandOptowave/United States
 Laser Power15W
 Laser PropertiesAll solid-state UV laser
 Laser Wavelength355nm
 GalvanometerSCANLAB/CTI Germany
 Field LensSILL/JENOPTIK Germany
 GuideHIWIN/Taiwan
 ReflectorUnited States(Optowave)
 Grating RulerRenishaw/United States
 CCDMVC/Italy
Accessories Configuration

 

Driver

 

Yaskawa / Japan

 ReflectorOptowave/United States
 Linear motorigus/Shanghai ECHU
 355 Beam ExpanderOptowave/United States
 Linear MotorHIWIN/Taiwan
 355 Beam ExpanderUnited States(Optowave)
 Dust ProcessorHOYAN
 Equipment BodyMarble/Qingdao
 Motion control cardTrinidad Cloud/Shenzhen, China
 Cutting SoftwareHoyan-ScanCut
 Spot Diameter20± 5um
 Maximum Scanning Range of Galvanometer50mm*50mm

 

 

 

 

 

 

 

 

 

Performance configuration

 

Cutting Substrate Thickness

Less than 1.2mm (Depending on the

cutting quality of different

materials)

 Repeatability±2 μm
 Positioning Accuracy±2 μm
 

 

Machining Accuracy

 

±20 μm

 Largest Format350*450mm*350*450mm(2 Table)
 Equipment Size1350mm(L)×1150mm(W)×1550mm(H)
 Support document formatGerber/DXF
 Equipment Weight2000KG
 Way of workingDouble Table Switch

 

 

 

 

 

 

 

Environmental Requirements

Power SupplyAC220V / 3.5KW
 Grid Demand(Two-phase) single-phase AC220V
 Temperature20±2 ℃
 Humidity

 

50-60% no condensation

 Air pressure requirement0.5~0.6Mpa(No need for stand-alone)
 Shock≤5um

 

 

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