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TG180 Single Sided PCB Power Supply Circuit Board With Green Solder Mask

Shenzhen Lefang Electronics Co., Ltd
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Address: A1-405 (Exit A, Fuyong Metro Station), Fuhai Information Port, Bao'an District, Shenzhen. 10mins from Shenzhen Bao'an International Airport by subway

Contact name:Cyan Hong

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Shenzhen Lefang Electronics Co., Ltd

TG180 Single Sided PCB Power Supply Circuit Board With Green Solder Mask

Country/Region china
City & Province shenzhen guangdong
Categories Switching Power Supply
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Product Details

 

 
TG180 Single Sided Printed Circuit Board for Power Bank PCB
 
The single sided Copper Base PCB is applied for power bank board, with 1.8 mm board thickness. The specification of the high TG 180 PCB board is 143.6 * 112.4 mm, with HASL surface treatment. The minimum aperture is 0.6 mm and green solder mask.

 

 

        How to get quick quotation?

 

        Step 1    Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc
        Step 2    Also please provide us the below details for quick quotation:

                Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others

                Material brand: SY / KB / Rogers  (optional)
                Material Specification:High Tg / copper based / aluminum based or others (optional)
                Board thickness: 0.1 - 6.0 mm
                Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um )
                Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin
                Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc
                Board size and quantity

 

If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.

 

       SAMPLE:

 

Board Basic Info - SAMPLE

                       Board material

Fr - 4

                       Material brand

KB

                       Material Specification

Tg 170

                       Board thickness

1.6 mm

                       Copper thickness

1 Oz

                       Surface Treatment

ENIG

                       Solder mask / sSilk print

Green / White

                       Board size

100 mm * 100 mm

                       Quantity

10k

 

 
        Technical Data
 

    No.

 

Item

 

Data

 

     1Layer count

1-20 layers

     2Raw material type

Halogen free FR-4, high Tg FR-4, thick copper FR-4, CEM-3, copper

 

based, aluminum based

     3Raw material brandRogers,Isola,Arlon, ITEQ, Hitachi, SY, KB,etc
     4Board thickness0.1-6.0mm
     5Max board size600 mm * 700 mm
     6Solder maskGreen, red, blue, black, white, yellow
     7Surface treatment

HASL/HASL lead free , OSP, Immersion gold / silver / tin , gold plating

 

(hard gold and soft gold), silver plating, tin plating, platinum plating,

 

carbon ink, and ENEPIG(electroless nickel - electroless palladium -

 

immersion gold)

     8Copper thickness0.05 Oz - 8 Oz (17 um-288 um )
     9Min Line width  /space0.065 mm / 0.065 mm
      10Finished hole size0.10 - 5.95 mm
      11Blind/buried via0.10 mm
      12Aspect ratio10:1
      13PTH tolerance+ / - 0.05 mm
      14Hole location tolerance+ / - 0.05 mm
      15Impedance control tolerance+ / - 8% mm
      16Outline tolerance+ / - 0.10 mm

 

 

        Lead Time
 
Layer countSample lead time/workdayBatch lead time/workday
1-2L26
4L58
6L59
8L610
10L810
12L812
14L1015
16L1018
18-40L (Up to difficulty)at least 18at least 24

P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays

       
 
        What kinds of quality Raw Materials will be used?

 

                     Board BrandITEQ, SY, Isola. Rogers, Arlon, Nelco, Taconic, Hitachi, KB,etc
                     PotionRohm & Haas, Atotech, Umicore
                     Printing InkTaiyo, Rongda
                     Dry FilmAsahi, Dupont, Etertec

 

 

Now send us your inquiry, and you will be replied within 8 hours!

 

 

 

 

 

 

Little knowledge - High Tg PCB
The glass transition temperature (Tg) is an important normative dimension for the base material that determines the temperature at which the resin matrix converts from a glassy, brittle condition into a soft, elastic one.
Normally high Tg refers to high heat resistance in PCB raw material.
The standard Tg for copper clad laminate is between 130 – 140℃. High Tg is generally greater than 170℃, and middle Tg is generally greater than 150℃. Basically the printed circuit board with Tg≥170℃, we call high Tg PCB.
The higher of TG value, the better of pcb high temperature resistance.

 

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