Shenzhen Found Printed Circuit Board Co., Ltd. |
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Dimensions | 178.04 x 47.06mm |
Line width/space | 0.2mm/0.2mm |
Base materials | 1.4mil Cu/0.8mil ADH/1mil PI, 1.4mil Cu/1.2mm FR4 |
Cover layer | 1mil ADH/1mil PI green oil |
Surface treatment | (Au: 0.03 to 0.09um, Ni: 2 to 6um) |
Outline tolerance | ±0.2mm |
Cover layer tolerance | ±0.3mm |
Main Technique Index | ||
Description | Parameters | |
Polyimide | Polyester | |
Base film Thickness (um) | 12.5,25,35,50 | 12.5,25,35,50 |
Copper Thickness (um) | 12,17.5,35,50,70,105 | |
Min. Line Width/Line Space (mm) | 0.075/0.075 | |
Min. Hole Size (mm) | 0.15 | |
Tolerance (mm) | Outline:+/-0.05; Coverlay: +/-0.2 | |
Peel Strength (kgf/cm) | Above 1.0 | Above 0.8 |
Solder Resistance | 260C 10 seconds | 204C 5 seconds |
Surface Treatment | ||
Content | Normal coating thickness | Normal PNL size |
Plating nickel gold (In house) | Ni:2-9um;Au:0.03-0.09um | 300mm×400 MM |
Plating hard gold (In house) | Ni:2-9um;Au:0.1-1.0um | 300mm×400 MM |
Plating soft gold (In house) | Ni:2-9um;Au:0.03-0.09um | 300mm×400 MM |
Plating pure tin (In house) | 2.0-8.0um | 300mm×400 MM |
Immersion Tin (In house) | 0.3-0.6um | 300mm×400 MM |
OSP (In house) | N/A | 300mm×400 MM |
ENIG (Hard Nickel) (In house) | Ni:2-6um;Au:0.03-0.10um | 300mm×400 MM |
ENIG (Soft Nickel) (In house) | Ni:2-6um;Au:0.03-0.10um | 300mm×400 MM |
ENEPIG (Hard Nickel) (In house) | Ni:2-6um;Au:0.03-0.10um | 300mm×400 MM |
HASL (Outsource) | Cover the pads with min thickness 1~2 um | 300mm×400 MM |
Immersion silver (Outsource) | Per standand creteria | 300mm×400 MM |
Bevelling of gold finger | |||
Bevel angle (°) | PCB thickness (mm) | Remaining thickness (mm) | Bevel depth (mm) |
20° | 1.6 | 0.5 | 1.51 |
2.0 | 0.65 | 1.85 | |
2.4 | 0.7 | 2.34 | |
30° | 1.6 | 0.5 | 0.95 |
2.0 | 0.65 | 1.16 | |
2.4 | 0.7 | 1.47 | |
45° | 1.6 | 0.5 | 0.5 |
2.0 | 0.65 | 0.65 | |
2.4 | 0.7 | 0.7 |
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