2-layer FR-4, TG150, large size round PCB Prototype Board rigid flex pcb manufacturers, Largeprototyping pcb board

2-layer FR-4, TG150, large size round PCB Prototype Board rigid flex pcb manufacturers, Largeprototyping pcb board
Product field: large electric equipment
Board thickness: 3.20±10%
Minimum hole: 0.30mm
Material: FR-4, TG150
Line width and distance 2.5/2.3mil,
Copper thickness: inner layer copper thickness 105UM
Impedance ±10%,
Hole treatment: resin plug hole,
Surface treatment: electric nickel gold,
Impedance tolerance: ±10%
Solder mask: green solder mask,

Size 1270mm*800mm/PCS
Thickness: hard board thickness 0.60mm±10%, soft board thickness 0.15mm±10%
E-Test: 100%

1. The PCBs are used for wide range of electronic products:
2. Such as Medical devices, Military equipment ,autos mobile ,CCTV, Power supply, GPS, UPS, Set-top Box, Telecommunication ,LED, etc.
3. 2L plate thickness: 1.852m; Large PCB Prototype Board rigid flex pcb manufacturers,Large PCB Prototype Board rigid flex pcb manufacturers,Large PCB Prototype Board,double side
4. Product area: South Gate System LED
5. Number of layers: 2L plate thickness: 1.2mm;
6. Size: 1852*492mm/12PCS
7. Process structure: FR-4TG135, minimum hole 0.60mm, minimum line width 4/4mi, linear test, aperture ratio 1:1,
8. Packing: true hole packaging + humidity card + moisture-proof beads / carton
9. Printed circuit board (pcb) and PCBA product areas
   Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
   Winding circuit board (fpc) and FPCA product areas
   CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

10. PCB, FPC process production capability

    Technical ltem		MassProduct		Advanced Technology
    		2016		2017		2018
    Max.Layer Count		26L		36L		80L
    Through-hole plate		2～45L		2～60L		2～80L
    Max.PCBSize(in)		24*52"		25*62"		25*78.75"
    The layer number of FPC		1～36L		1～50L		1～60L
    Max.PCBSize(in)		9.8"*196"		9.8"*196"		10"*196"Reel to reel
    Layeredplatelayer		2～12L		2～18L		2～26L
    Max.PCBSize(in)		9"*48"		9"*52"		9"*62"
    Combination of hard and soft layers		3～26L		3～30L		3～50L
    Interconnect HDI		5+X+5Interconnect HDI		7+X+7Interconnect HDI		8+X+8,Interconnect HDI
    HDI PCB		4～45L		4～60L		4～80L
    Interconnect HDI		3+20+3		4+X+4Interconnect HDI		4+X+4,Interconnect HDI
    Max.PCBSize(in)		24"*43"		24"*49"		25"*52"
    Material		FR-4 Rogers		FR-4 Rogers		FR-4 Rogers
    Base material		Halogenfree,LowDK		Halogenfree,LowDK		Halogenfree,LowDK
    Build-up Material		FR-4		FR-4		FR-4
    BOard,Thickness(mm)	Min.12L(mm)	0.43		0.42～8.0mm		0.38～10.0mm
    	Min.16L(mm)	0.53		1.60～8.0mm		0.45～10.0mm
    	Min.18L(mm)	0.63		2.0～8.0		0.51～10.0mm
    	Min.52L(mm)	0.8		2.50～8.0mm		0.65～10.0mm
    	MAX(mm)	3.5		10.0mm		10.0mm
    Min.CoreThickness um(mil)		254"(10.0)		254"(10.0)		0.10～254(10.0mm)
    Min.Build up Dielectric		38(1.5)		32(1.3)		25(1.0)
    BaseCopperWeight	Inner Layer	4/1-8 OZ		4/1-15 OZ		4/1-0.30mm
    	Out Layer	4/1-10 OZ		4/1-15 OZ		4/1-30 OZ
    Gold thick		1～40u"		1～60u"		1～120u"
    Nithick		76～127u"		76～200u"		1～250u"
    Min.HOle/Land um(mil)		150/300(6/12)		100/200(4/8)		100/200(4/8)
    Min.Laser via/landum(mil)		60/170(2.4/6.8)		50/150(2/6)		50/150(2/6)
    Min. IVH,Hole size/landum(mil)		150/300(6/12)		100/200(4/8)		100/200(4/8)
    DieletricThickness		38(1.5)		32(1.3)		32(1.3)
    		125(5)		125(5)		125(5)
    SKipvia		Yes		Yes		Yes
    viaoNhie(laserviaon BuriedPTH)		Yes		Yes		Yes
    Laser Hole Filling		Yes		Yes		Yes
    Technicalltem				Mass Product		Advanced Technolgy
    				2017year		2018year	2019year
    Drill hole depth ratio		ThroughHole		2017year		.40:1	.40:1
    Aspet Ratio		Micro Via		.35:1		1.2:1	1.2:1
    Copper Filling Dimple Size um(Mil)				10(0.4)		10(0.4)	10(0.4)
    Min.LineWidth＆space		lnner Layer um(mil)		45/45(1.8/1.8)		38/38(1.5/1.5)	38/38(1.5/1.5)
    		Plated Layer um(mil)		45/45(1.8/1.8)		38/38(1.5/1.5)	38/38(1.5/1.5)
    BGAPitch mm(Mil)				0.3		0.3	0.3
    Min.PTH Hole ring um(mil)				75(3mil)		62.5(2.5mil)	62.5(2.5mil)
    Line Width Control		∠2.5MIL		±0.50		±0.50	±0.50
    		2.5Mil≤L/W∠4mil		±0.50		±0.50	±0.50
    		≦3mil		±0.60		±0.60	±0.60
    Laminated structure		Layer by layer		3+N+3		4+N+4	5+N+5
    		Sequential Build-up		20L Any Layer		36L Any Layer	52L Any Layer
    		Multi-layer overlay		N+N		N+N	N+N
    				N+X+N		N+X+N	N+X+N
    		sequential Lamination		2+(N+X+N)+2		2+(N+X+N)+2	2+(N+X+N)+2
    		Soft and hard bonding		2+(N+X+N)+2		2+(N+X+N)+2	2+(N+X+N)+2
    PTH filling process				PTH resin plug hole + plating fill Electroplated hole/copper plug hole		PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole

     

    PCB, FPC main material supplier

    NO	supplier		Supply material name			Material origin
    1	Japan		High frequency materials, PI, covering membrane,Copper berth			Mitsubishi Japan
    2	dupont		High frequency materials, PI, covering film, dry film,Copper berth			Japan
    3	panasonic		High frequency materials, PI, covering membrane,Copper berth			Japan
    4	SanTie		PI, covering membrane			Japan
    5	Born good		FR-4,PI,PP,Copper berth			shenzhen, China
    6	A rainbow		PI, covering membrane,Copper berth			Taiwan
    7	teflon		High frequency materials			The United States
    8	Rogers		High frequency materials			The United States
    9	Nippon Steel		PI, covering membrane,Copper berth			Taiwan
    10	sanyo		PI, covering membrane,Copper berth			Japan
    11	South Asia		FR-4,PI,PP,Copper berth			Taiwan
    12	doosan		FR-4,PP			South Korea
    13	Tai Yao plate		FR-4,PP,Copper berth			Taiwan
    14	Alight		FR-4,PP,Copper berth			Taiwan
    15	Yaoguang		FR-4,PP,Copper berth			Taiwan
    16	Yalong		FR-4,PP			The United States
    17	ISOAL		FR-4,PP			Japan
    18	OAK		Buried, buried resistance, PP			Japan
    19	United States 3M		FR-4,PP			The United States
    20	Bergs		Copper and aluminum matrix			Japan
    21	The sun		ink			Taiwan
    22	Murata		ink			Japan
    23	generous andbenevolent		PI, covering membrane,Copper berth			China's jiangxi
    24	Yasen		PPI, covering membrane			China jiangsu
    25	Yong Sheng Tai		ink			China guangdong panyu
    26	mita		ink			Japan
    27	Transcript		ceramic material			Taiwan
    28	HOME		ceramic material			Japan
    29	Fe-Ni-Mn		Alloy Invar, Section Steel			Taiwan

     

     

    Our Quality processes include:
    1. IQC: Incoming Quality Control (Incoming Materials Inspection)
    2. First Article Inspection for every process
    3. IPQC: In Process Quality Control
    4. QC: 100% Test & Inspection
    5. QA: Quality Assurance based on QC inspection again
    6. Workmanship: IPC-A-610, ESD
    7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004

     

    Certificates:
    ISO9001-2008
    ISO/TS16949
    UL
    IPC-A-600G and IPC-A-610E Class II compliance
    Customer's requirements

     

    Quick Detail:

    1. PCB Assembly on SMT and DIP

    2. PCB schematic drawing/ layout /producing

    3. PCBA clone/change board

    4. Components sourcing and purchasing for PCBA

    5. Enclosure design and plastic injection molding

    6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,

    7. IC programming

    PCB, FPC product application field
    Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

     

    FAQ:
    Q: What files do you use in PCB fabrication?
    A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
    Q: Is it possible you could offer sample?
    A: Yes, we can custom you sample to test before mass production
    Q: When will I get the quotation after sent Gerber, BOM and test procedure?
    A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
    Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?
    A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing
    Q: How can I make sure the quality of my PCB?
    A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

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