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Thermoelectric Separation Multilayer Printed Circuit Board Copper Based For Industrial Products

Shenzhen Chaosheng Electronic Technology Co.,Ltd
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Address: Huishang Building, 19-128 Nathan Road, Yau Tsim Sha Tsui, Yau Tsim, Hong Kong

Contact name:Mank.Li

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Shenzhen Chaosheng Electronic Technology Co.,Ltd

Thermoelectric Separation Multilayer Printed Circuit Board Copper Based For Industrial Products

Country/Region china
City & Province hong kong hong kong
Categories Copper Strips
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Product Details

Thermoelectric Separation Copper Based PCB PCB Ensure Benefit Of Choosing The Aluminum PCB For Major Usage alumina ceramicsAL203

Printed circuit board (pcb) and PCBA products
Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
Flexible circuit board (FPC) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

Process structure: alumina ceramic 96%, thermal conductivity 3W
Surface treatment: Shenjin 4U "

chaosheng Circuits Co., Limited offers ceramic PCB for yourprinted circuit boards needs. Many users of printed circuit boards find ceramicPCBs have an advantage over traditional boards made of other materials. This is because they provide suitable substrates for electronic circuits that have a high thermal conductivity and a low expansion coefficient (CTE). The multilayer ceramic PCB is extremely versatile and can replace a complete traditional printed circuit board with a less complex design and increased performance. You can use them for high-power circuits, chip-on-board modules, proximity sensors and more.

chaosheng Thermal Conductivity, Low Expansion Ceramic PCB

Besides its enviable thermal properties and expansion coefficient, ceramic boards work at operating temperatures up to 350 degrees Celsius, create a smaller package size, offer better high-frequency performance and can come in hermetic packages for no water absorption. Using ceramic PCBs can also result in a lower overall system cost and be especially cost-effective for dense packages, since you have parallel processing of layers.
Use Ceramic PCB to Increase the Performance of Electronic Circuits
It is important to choose the highly appropriate substrates for your electronic circuits. There are different kinds of boards available, but ceramic pcb get more fame among circuit board users because of its versatility. If you want to get the best kinds of boards, you can hire us. We offer the most reliable solutions based on the printed circuit boards requirements of our clients. The main reason to use these solutions is that they are ideal for all kinds of electronic circuits which have minimal expansion coefficient and increased thermal conductivity. With better versatility, it appears as a perfect alternative to existing printed circuit board boasting of increased performance and minimal complex design. It ensures that ceramic pcb work effectively on chip-on-board modules, high-power circuits, and proximity sensors.

Enjoy better thermal conductivity

The specialized thing about our solutions is that they are well-equipped with enviable expansion coefficient and thermal properties. Apart from that, they are working at the operating temperatures of roughly about 350 degrees Celsius. It not only creates a compact package size but also provide an increased level of frequency performance. With ceramic pcb, you can reduce the system cost. It is because we offer the finest range of solutions at very cost-effective rates. If you desire to collect more useful information about our solutions, you can visit our official portal. It is the right place where you can look at our product details before making any decision.

according to your test procedure.

Electric Rigid FR4 Copper Clad Circuit Board , Circuit Board Printing ServiceElectric Rigid FR4 Copper Clad Circuit Board , Circuit Board Printing Service

PCB, FPC product application field

Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

 

    Our Service

     

     

    PCB, FPC process production capability

    Technical ltemMassProductAdvanced Technology
    201620172018
    Max.Layer Count26L36L80L
    Through-hole plate2~45L2~60L2~80L
    Max.PCBSize(in)24*52"25*62"25*78.75"
    The layer number of FPC1~36L1~50L1~60L
    Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
    Layeredplatelayer2~12L2~18L2~26L
    Max.PCBSize(in)9"*48"9"*52"9"*62"
    Combination of hard and soft layers3~26L3~30L3~50L
    Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
    HDI PCB4~45L4~60L4~80L
    Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
    Max.PCBSize(in)24"*43"24"*49"25"*52"
    MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
    Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
    Build-up MaterialFR-4FR-4FR-4
    BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
    Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
    Min.18L(mm)0.632.0~8.00.51~10.0mm
    Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
    MAX(mm)3.510.0mm10.0mm
    Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
    Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
    BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
    Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
    Gold thick1~40u"1~60u"1~120u"
    Nithick76~127u"76~200u"1~250u"
    Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
    Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
    DieletricThickness38(1.5)32(1.3)32(1.3)
    125(5)125(5)125(5)
    SKipviaYesYesYes
    viaoNhie(laserviaon BuriedPTH)YesYesYes
    Laser Hole FillingYesYesYes
    TechnicalltemMass ProductAdvanced Technolgy
    2017year2018year2019year
    Drill hole depth ratioThroughHole2017year.40:1.40:1
    Aspet RatioMicro Via.35:11.2:11.2:1
    Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
    Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
    BGAPitch mm(Mil)0.30.30.3
    Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
    Line Width Control∠2.5MIL±0.50±0.50±0.50
    2.5Mil≤L/W∠4mil±0.50±0.50±0.50
    ≦3mil±0.60±0.60±0.60
    Laminated structureLayer by layer3+N+34+N+45+N+5
    Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
    Multi-layer overlayN+NN+NN+N
    N+X+NN+X+NN+X+N
    sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
    PTH filling processPTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole

     

    PCB, FPC main material supplier

    NOsupplierSupply material nameMaterial origin
    1JapanHigh frequency materials, PI, covering membrane,Copper berthMitsubishi Japan
    2dupontHigh frequency materials, PI, covering film, dry film,Copper berthJapan
    3panasonicHigh frequency materials, PI, covering membrane,Copper berthJapan
    4SanTiePI, covering membraneJapan
    5Born goodFR-4,PI,PP,Copper berthshenzhen, China
    6A rainbowPI, covering membrane,Copper berthTaiwan
    7teflonHigh frequency materialsThe United States
    8RogersHigh frequency materialsThe United States
    9Nippon SteelPI, covering membrane,Copper berthTaiwan
    10sanyoPI, covering membrane,Copper berthJapan
    11South AsiaFR-4,PI,PP,Copper berthTaiwan
    12doosanFR-4,PPSouth Korea
    13Tai Yao plateFR-4,PP,Copper berthTaiwan
    14AlightFR-4,PP,Copper berthTaiwan
    15YaoguangFR-4,PP,Copper berthTaiwan
    16YalongFR-4,PPThe United States
    17ISOALFR-4,PPJapan
    18OAKBuried, buried resistance, PPJapan
    19United States 3MFR-4,PPThe United States
    20BergsCopper and aluminum matrixJapan
    21The suninkTaiwan
    22MuratainkJapan
    23generous andbenevolentPI, covering membrane,Copper berthChina's jiangxi
    24YasenPPI, covering membraneChina jiangsu
    25Yong Sheng TaiinkChina guangdong panyu
    26mitainkJapan
    27Transcriptceramic materialTaiwan
    28HOMEceramic materialJapan
    29Fe-Ni-MnAlloy Invar, Section SteelTaiwan

     

    Quality Assurance:
    Our Quality processes include:
    1. IQC: Incoming Quality Control (Incoming Materials Inspection)
    2. First Article Inspection for every process
    3. IPQC: In Process Quality Control
    4. QC: 100% Test & Inspection
    5. QA: Quality Assurance based on QC inspection again
    6. Workmanship: IPC-A-610, ESD
    7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004

    Certificates:
    ISO9001-2008
    ISO/TS16949
    UL
    IPC-A-600G and IPC-A-610E Class II compliance
    Customer's requirements

    Quick Detail:

     

    • PCB Production Service.
    • PCB FPC design Service.
    • PCB Assembly Service. (SMT, BGA, DIP)
    • PCBA Housing assembly serivce.
    • PCBA Final Functional Testing.
    • PCB PCBA Copy Service.
    • Electronic Components Purchasing & BOM List Purchasing Services.
    • PCB SMT Stencil. (Laser cut & Etching)
    • Quality Assurance:
      Our Quality processes include:
      1. IQC: Incoming Quality Control (Incoming Materials Inspection)
      2. First Article Inspection for every process
      3. IPQC: In Process Quality Control
      4. QC: 100% Test & Inspection
      5. QA: Quality Assurance based on QC inspection again
      6. Workmanship: IPC-A-610, ESD
      7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004

      Certificates:
      ISO9001-2008
      ISO/TS16949
      UL
      IPC-A-600G and IPC-A-610E Class II compliance
      Customer's requirements

       

      Quick Detail:

      1. PCB Assembly on SMT and DIP

      2. PCB schematic drawing/ layout /producing

      3. PCBA clone/change board

      4. Components sourcing and purchasing for PCBA

      5. Enclosure design and plastic injection molding

      6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,

      7. IC programming

       

      PCB, FPC product application field
      Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

       

      FAQ:
      Q: What files do you use in PCB fabrication?
      A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
      Q: Is it possible you could offer sample?
      A: Yes, we can custom you sample to test before mass production
      Q: When will I get the quotation after sent Gerber, BOM and test procedure?
      A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
      Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?
      A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing
      Q: How can I make sure the quality of my PCB?
      A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

    • PCB Assembly on SMT and DIP
    • PCB schematic drawing/ layout /producing
    • PCBA clone/change board
    • Components sourcing and purchasing for PCBA
    • Enclosure design and plastic injection molding
    • Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,
    • IC programming

    Industrial products DCB Ceramic PCB Ensure Benefit Of Choosing The Aluminum PCB For Major Usage alumina ceramicsAL203

    Industrial products DCB Ceramic PCB Ensure Benefit Of Choosing The Aluminum PCB For Major Usage alumina ceramicsAL203

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