6layers, double-sided SD card ultra-thin PCB Ultra Thin PCB rigid flex pcb manufacturers,thin pcb,four layerpcb,thin pcb

6layers, double-sided SD card ultra-thin PCB Ultra Thin PCB rigid flex pcb manufacturers,thin pcb,four layerpcb,thin pcb Ultra Thin PCB rigid flex pcb manufacturers,thin pcb,four layer pcb Product Description prototype pcb service pcb service

Product area: memory card

Number of layers: 6layersThickness: 0.30mm

1. Process structure: FR-4, line width line spacing 4/4mil,
2. minimum hole 0.15mm, resin hole filling
3. Surface treatment: immersion gold + gold finger
4. Packing: vacuum packaging + humidity card + moisture-proof beads + carton
5.  
6. Printed circuit board (pcb) and PCBA product areas
   Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
   Winding circuit board (fpc) and FPCA product areas
   CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

Little knowledge - PCB Circuit Board

1. A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate.
2. Components (e.g. capacitors, resistors or active devices) are generally soldered on the PCB. Advanced PCBs may contain components embedded in the substrate.
3. There are three kinds of PCB, including single sided pcb (one copper layer), double sided pcb (two copper layers)and multi-layer pcb (outer and inner layers). Conductors on different layers are connected with vias. Multilayer PCBs allow for much higher component density

4. PCB, FPC product application field
   Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

    

   FAQ:
   Q: What files do you use in PCB fabrication?
   A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
   Q: Is it possible you could offer sample?
   A: Yes, we can custom you sample to test before mass production
   Q: When will I get the quotation after sent Gerber, BOM and test procedure?
   A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
   Q: How can I know the process of my PCB production?
   A: 5-15days for PCB production and components purchasing, and 14-18 days for PCB assembly and Testing
   Q: How can I make sure the quality of my PCB?
   A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

    

   PCB, FPC process production capability

   Technical ltem		MassProduct		Advanced Technology
   		2016		2017		2018
   Max.Layer Count		26L		36L		80L
   Through-hole plate		2～45L		2～60L		2～80L
   Max.PCBSize(in)		24*52"		25*62"		25*78.75"
   The layer number of FPC		1～36L		1～50L		1～60L
   Max.PCBSize(in)		9.8"*196"		9.8"*196"		10"*196"Reel to reel
   Layeredplatelayer		2～12L		2～18L		2～26L
   Max.PCBSize(in)		9"*48"		9"*52"		9"*62"
   Combination of hard and soft layers		3～26L		3～30L		3～50L
   Interconnect HDI		5+X+5Interconnect HDI		7+X+7Interconnect HDI		8+X+8,Interconnect HDI
   HDI PCB		4～45L		4～60L		4～80L
   Interconnect HDI		3+20+3		4+X+4Interconnect HDI		4+X+4,Interconnect HDI
   Max.PCBSize(in)		24"*43"		24"*49"		25"*52"
   Material		FR-4 Rogers		FR-4 Rogers		FR-4 Rogers
   Base material		Halogenfree,LowDK		Halogenfree,LowDK		Halogenfree,LowDK
   Build-up Material		FR-4		FR-4		FR-4
   BOard,Thickness(mm)	Min.12L(mm)	0.43		0.42～8.0mm		0.38～10.0mm
   	Min.16L(mm)	0.53		1.60～8.0mm		0.45～10.0mm
   	Min.18L(mm)	0.63		2.0～8.0		0.51～10.0mm
   	Min.52L(mm)	0.8		2.50～8.0mm		0.65～10.0mm
   	MAX(mm)	3.5		10.0mm		10.0mm
   Min.CoreThickness um(mil)		254"(10.0)		254"(10.0)		0.10～254(10.0mm)
   Min.Build up Dielectric		38(1.5)		32(1.3)		25(1.0)
   BaseCopperWeight	Inner Layer	4/1-8 OZ		4/1-15 OZ		4/1-0.30mm
   	Out Layer	4/1-10 OZ		4/1-15 OZ		4/1-30 OZ
   Gold thick		1～40u"		1～60u"		1～120u"
   Nithick		76～127u"		76～200u"		1～250u"
   Min.HOle/Land um(mil)		150/300(6/12)		100/200(4/8)		100/200(4/8)
   Min.Laser via/landum(mil)		60/170(2.4/6.8)		50/150(2/6)		50/150(2/6)
   Min. IVH,Hole size/landum(mil)		150/300(6/12)		100/200(4/8)		100/200(4/8)
   DieletricThickness		38(1.5)		32(1.3)		32(1.3)
   		125(5)		125(5)		125(5)
   SKipvia		Yes		Yes		Yes
   viaoNhie(laserviaon BuriedPTH)		Yes		Yes		Yes
   Laser Hole Filling		Yes		Yes		Yes
   Technicalltem				Mass Product		Advanced Technolgy
   				2017year		2018year	2019year
   Drill hole depth ratio		ThroughHole		2017year		.40:1	.40:1
   Aspet Ratio		Micro Via		.35:1		1.2:1	1.2:1
   Copper Filling Dimple Size um(Mil)				10(0.4)		10(0.4)	10(0.4)
   Min.LineWidth＆space		lnner Layer um(mil)		45/45(1.8/1.8)		38/38(1.5/1.5)	38/38(1.5/1.5)
   		Plated Layer um(mil)		45/45(1.8/1.8)		38/38(1.5/1.5)	38/38(1.5/1.5)
   BGAPitch mm(Mil)				0.3		0.3	0.3
   Min.PTH Hole ring um(mil)				75(3mil)		62.5(2.5mil)	62.5(2.5mil)
   Line Width Control		∠2.5MIL		±0.50		±0.50	±0.50
   		2.5Mil≤L/W∠4mil		±0.50		±0.50	±0.50
   		≦3mil		±0.60		±0.60	±0.60
   Laminated structure		Layer by layer		3+N+3		4+N+4	5+N+5
   		Sequential Build-up		20L Any Layer		36L Any Layer	52L Any Layer
   		Multi-layer overlay		N+N		N+N	N+N
   				N+X+N		N+X+N	N+X+N
   		sequential Lamination		2+(N+X+N)+2		2+(N+X+N)+2	2+(N+X+N)+2
   		Soft and hard bonding		2+(N+X+N)+2		2+(N+X+N)+2	2+(N+X+N)+2
   PTH filling process				PTH resin plug hole + plating fill Electroplated hole/copper plug hole		PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole

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   ultra thin flex pcb,

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