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10 Layer Through Hole PCB Assembly Anti Static Film PCB+SMT+DIP+PCBA Production

Shenzhen Chaosheng Electronic Technology Co.,Ltd
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[China] country

Address: Huishang Building, 19-128 Nathan Road, Yau Tsim Sha Tsui, Yau Tsim, Hong Kong

Contact name:Mank.Li

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Shenzhen Chaosheng Electronic Technology Co.,Ltd

10 Layer Through Hole PCB Assembly Anti Static Film PCB+SMT+DIP+PCBA Production

Country/Region china
City & Province hong kong hong kong
Categories Electronics Production Machinery
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Product Details

10-layer PCB production,PCB+SMT+DIP+PCBA production,SMT PCB Service,anti-static film,Flexible Multilayer Printed

 

Product Description

 

  1. 10-layer PCB production,PCB+SMT+DIP+PCBA production,SMT PCB Service,anti-static film,Flexible Multilayer Printed Circuit Board Assembly for
  2. High Speed SMT PCB Assembly Lea,SMT PCB Service,anti-static film,Flexible Multilayer Printed Circuit Board Assembly for
  3. Industrial product series
  4. 10-layer PCB production, purchasing components, SMT+DIP+ plug-in production
  5. Packing: Pearl anti-static film / vacuum packaging / plastic box
  6. PCB, FPC process production capability

  7. One stop services:
  8. PCB layout
  9. Electronic design
  10. Engineering
  11. PCB fabrication
  12. PCB Assembly
  13. Box Build
  14. IC Programming
  15. Testing
  16. Parts sourcing
  17. Supply management
  18. After sales servies et

    Printed circuit board (pcb) and PCBA products
    Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
    Flexible circuit board (FPC) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

PCB capability and services:

  1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
  2.  Flexible PCB (up to 10 layers)
  3.  Rigid-flex PCB (up to 8 layers) CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
  4. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
  5. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
  6. Quantities range from prototype to volume production.
  7.  100% E-Test

PCB Assembly services:

  1. SMT Assembly
  2. Automatic Pick & Place
  3. Component Placement as Small as 0201
  4. Fine Pitch QEP - BGA
  5. Automatic Optical Inspection

Through-hole Assembly

  1. Wave Soldering
  2. Hand Assembly and Soldering
  3. Material Sourcing
  4. IC pre-programming / Burning on-line
  5. Function testing as requested
  6. Aging test for LED and Power boards
  7. Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
  8. Packing design

PCB, FPC process production capability

Technical ltemMassProductAdvanced Technology
201620172018
Max.Layer Count26L36L80L
Through-hole plate2~45L2~60L2~80L
Max.PCBSize(in)24*52"25*62"25*78.75"
The layer number of FPC1~36L1~50L1~60L
Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
Layeredplatelayer2~12L2~18L2~26L
Max.PCBSize(in)9"*48"9"*52"9"*62"
Combination of hard and soft layers3~26L3~30L3~50L
Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
HDI PCB4~45L4~60L4~80L
Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
Max.PCBSize(in)24"*43"24"*49"25"*52"
MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
Build-up MaterialFR-4FR-4FR-4
BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
Min.18L(mm)0.632.0~8.00.51~10.0mm
Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
MAX(mm)3.510.0mm10.0mm
Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
Gold thick1~40u"1~60u"1~120u"
Nithick76~127u"76~200u"1~250u"
Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
DieletricThickness38(1.5)32(1.3)32(1.3)
125(5)125(5)125(5)
SKipviaYesYesYes
viaoNhie(laserviaon BuriedPTH)YesYesYes
Laser Hole FillingYesYesYes
TechnicalltemMass ProductAdvanced Technolgy
2017year2018year2019year
Drill hole depth ratioThroughHole2017year.40:1.40:1
Aspet RatioMicro Via.35:11.2:11.2:1
Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
BGAPitch mm(Mil)0.30.30.3
Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
Line Width Control∠2.5MIL±0.50±0.50±0.50
2.5Mil≤L/W∠4mil±0.50±0.50±0.50
≦3mil±0.60±0.60±0.60
Laminated structureLayer by layer3+N+34+N+45+N+5
Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
Multi-layer overlayN+NN+NN+N
N+X+NN+X+NN+X+N
sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
PTH filling processPTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole


Certificate:

IPC Standard

ISO9001

ISO/TS16949

UL

 

Testing and value added services:

AOI (Automatic optical inspection)

ICT(In-circuit test)

Reliability test

X-Ray Test

Analogue and digital function test

Firmware programming

 

Shipping Method and Payment terms:

1. By DHL, UPS, FedEx, TNT, or using clients account.

2. We suggest you using our DHL, UPS, FedEx, TNT forwarder for cost saving.

3. By sea for mass quantity according to customer's requirement.

4. By customer's Forwarder

6. T/T, West Union, etc.

 

PCB, FPC product application field
Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray

 

FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: How can I know the process of my PCB production?
A: 5-15days for PCB production and components purchasing, and 14-18 days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

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