Hard Drive Bare Quick Turn Printed Circuit Boards With 2l Fr4 Material 0.8mm Flash Gold 1oz

Hard Drive Bare Quick Turn Printed Circuit Boards With 2l Fr4 Material 0.8mm Flash Gold 1oz

TECHNOLOGY:

. RoHS/ Lead Free

. HDI Microvias

. Blind Vias

. Buried Vias

. Selective Plating

. Impedance Control

Manufacturing Standard:

. IPC-A-600G Class II

. IPC-A-600G Class III

. PERFAG 2E for Double-Sided Board

. PERFAG 3C for Multilayer Board

Capability

Min. Finished Holes Size: 0.008" (0.20mm)

Micro vias diameter: 0.004 TO 0.010 inches (0.10 - 0.25mm)

Minimum line width/spacing: 0.004/0.004 inches (0.10mm/ 0.10mm)

Maximum copper thickness: 5oz (140um)

Thin board thickness:

. DS - 0.008 inches (0.20mm)

. 4/L - 0.016 (0.40mm)

. 6/L - 0.020 inches (0.60mm)

Maximum board thickness:

. 275.8mil (7.0mm)

Surface treatment:

. HASL/lead free HAL/gold plating

. Immersion gold

. Immersion tin

. Immersion silver

. Gold fingers (hard gold)

. OSP

Other:

. Account of layers: Double-side to above 20 layers (1 to 30 layers)

. Max PCB dimensions: 23 X 35 inches (584.2 X 889.0mm)

. Solder mask bridge between solder dam: 4mil (0.10mm)

. Minimum solder mask annular: 1.5mil (0.038mm)

. Min thickness of solder mask: 0.40mil (10um)

. Solder mask colors: Green, yellow, black, blue, matte, transparence LPI solder mask and peelable

solder mask

. Min height of Legend: 4mil (0.10mm)

. Min width of front: 25mil (0.635mm)

. Legend colors: White, yellow, black

Data format: GERBER, PROTEL, PADS2000, Powerpcb, ODB++

Special material: HTG FR4, high frequency (Rogers, Teflon, ARLON, TYCONIC), halogen free, different material mixing laminating

Other test: Impendence control, resistor of hole test, micro section, ionic cleanliness test, Soldering capacity, thermal shocking, reliability test, etc.