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SMT PCB Assembly And Soldering DIP Video Surveillance Terminal Motherboard

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SMT PCB Assembly And Soldering DIP Video Surveillance Terminal Motherboard

Country/Region	china
City & Province	guangzhou
Categories	Motherboards

Product Details

SMT Chip Processing DIP Soldering Video Surveillance Terminal Motherboard

Product parameters

Types of Assembly	SMT (Surface-Mount Technology)
	THD (Thru-Hole Device)
	SMT & THD mixed
	Double sided SMT and THD assembly
SMT capability	PCB layer: 1-32 layers;
	PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards;
	Board type: Rigid FR-4, Rigid-Flex boards
	PCB thickness: 0.2mm-7.0mm;
	PCB dimension width: 40-500mm;
	Copper thickness: Min:0.5oz; Max: 4.0oz;
	Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
	Component size: 0.60.3mm-33.533.5mm;
	Component height: 6mm(max);
	Pin spacing laser recognition over 0.65mm;
	High resolution VCS 0.25mm;
	BGA spherical distance: ≥0.25mm;
	BGA Globe distance: ≥0.25mm;
	BGA ball diameter: ≥0.1mm;
	IC foot distance: ≥0.2mm;

Types of Assembly	SMT (Surface-Mount Technology)
	THD (Thru-Hole Device)
	SMT & THD mixed
	Double sided SMT and THD assembly
SMT capability	PCB layer: 1-32 layers;
	PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards;
	Board type: Rigid FR-4, Rigid-Flex boards
	PCB thickness: 0.2mm-7.0mm;
	PCB dimension width: 40-500mm;
	Copper thickness: Min:0.5oz; Max: 4.0oz;
	Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
	Component size: 0.60.3mm-33.533.5mm;
	Component height: 6mm(max);
	Pin spacing laser recognition over 0.65mm;
	High resolution VCS 0.25mm;
	BGA spherical distance: ≥0.25mm;
	BGA Globe distance: ≥0.25mm;
	BGA ball diameter: ≥0.1mm;
	IC foot distance: ≥0.2mm;

Types of Assembly	SMT (Surface-Mount Technology)
	THD (Thru-Hole Device)
	SMT & THD mixed
	Double sided SMT and THD assembly
SMT capability	PCB layer: 1-32 layers;
	PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards;
	Board type: Rigid FR-4, Rigid-Flex boards
	PCB thickness: 0.2mm-7.0mm;
	PCB dimension width: 40-500mm;
	Copper thickness: Min:0.5oz; Max: 4.0oz;
	Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
	Component size: 0.60.3mm-33.533.5mm;
	Component height: 6mm(max);
	Pin spacing laser recognition over 0.65mm;
	High resolution VCS 0.25mm;
	BGA spherical distance: ≥0.25mm;
	BGA Globe distance: ≥0.25mm;
	BGA ball diameter: ≥0.1mm;
	IC foot distance: ≥0.2mm;

Why did you choose us?
1,Experienced
Focused on PCBA electronic manufacturing for 8 years
Best Partner for Listed Companies
Serving over 60 European and American enterprises
Helping clients solve design issues over 500 times
Helped customers solve MP issues over 800 times.
Helping customers improve testing reliability over 1000 times
2,Quality control
ISO9001: 2015
ISO13485
IATF16949
MES
Traceability system
Fully automatic FCT testing
3,Quick response
Quick response principle within 1 hour
7 days * 24 hours
Team responsibility system
Sales personnel with a bachelor's degree or above