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Fr4 CEM3 Double Sided Copper Clad Laminate Pcb Board Electromagnetic Compatibility

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MOKO TECHNOLOGY LTD

Fr4 CEM3 Double Sided Copper Clad Laminate Pcb Board Electromagnetic Compatibility

City & Province shenzhen guangdong
Categories Switching Power Supply
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Product Details

 Fr4 CEM3 Double Sided Copper Clad Laminate Pcb Board Electromagnetic Compatibility

 

Quick Details

Place of Origin:China (Mainland)Brand Name:BangBaneModel Number:BangBane PCB
Base Material:

FR4,FR1,CEM3,

Aluminum,Ceramic

Copper Thickness:1oz~4ozBoard Thickness:0.5~3.2mm
Min. Hole Size:0.15mmMin. Line Width:0.08mmMin. Line Spacing:0.08mm
Surface Finishing:
HASL,Lead Free HASL, OSP,ENIG,Gold plating
PCB max. Panel Size:
541*647mm(Special can do to 950mm)
Finish Hole Size:
PTH +/-0.003'' ,NPTH +/-0.002"
Hole Position Accuracy:+/-0.003Aspect Ratio:Min 1:8Hardness of resist ink:≥6H
Copper foil peel off endurance:1.4N/mmFlame resistance:94V-0Impedance control:±5%
PCB Item:double side pcbpcb Certificate:UL, SGS, RoSH, TS certificate

 

Specifications

double sided copper clad laminate pcb board
a.PCB OEM&ODM Clone/Copy
b.PCB Design
c.Turnkey service
d.UL,SGS,RoSH,TS

double sided copper clad laminate pcb board

 

No.ItemSpecification
1PCB Layers1 to 24 layers 
2PCB Max working panel area457 x 610 mm
3Min board thickness 4 layer: 0.40mm 
6 layer: 0.80mm 
8 layer: 1.00mm 
10 layer: 1.20mm 
4Min trace width0.10mm
5Min spacing0.10mm
6Min hole diameter0.20mm
7Min Copper thickness in hole0.020mm
8PTH size tolerance±0.05mm
9NPTH size tolerance±0.025mm
10Hole position tolerance±0.05mm
11Dimension tolerance±0.1mm
12Min solder mask dam0.08mm
13Insulation resistance1E+12Ω (normal condition)
14Max Board thickness/Hole size Rate10:1
15Thermal shock endurance288 3 times in 10sec
16Max Board twist and wrap≤0.7%
17High Vlotage endurance1.3KV/mm
18Copper foil peel off endurance1.4N/mm
19Hardness of resist ink≥6H
20Flame resistance94V-0
21Impedance control±5%
22Certificate ISO 9001:2000;ISO 14001;ISO/TS16949:2002 ,      UL E203640

 

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