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Access Control Electronic Prototype SMT Assembly 4 Layers 1.6mm Board Thickness

Shenzhen Shinelink Technology Ltd
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Address: Room 201 Building A2 Industrial Park No. 6 Yuanchuang Park Rongfu road, Fucheng Street Longhua District Shenzhen City 518131

Contact name:Sandy

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Shenzhen Shinelink Technology Ltd

Access Control Electronic Prototype SMT Assembly 4 Layers 1.6mm Board Thickness

Country/Region china
City & Province shenzhen guangdong
Categories Motherboards
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Product Details

Access Control Electronic SMT PCB Assembly 4 Layers Fast Delivery

 

 

Our production capacity

 

PCB ItemManufacture Capacity
Layer Counts1--20L
Base MaterialFR4,High-TG FR4,CEM3,aluminum,High Frequency(Rogers,Taconic,Aron,PTFE,F4B)
Material Thickness(mm)0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4, 3.2
Max board size(mm)1200x400mm
Board Outline Tolerance±0.15mm
Board Thickness0.4mm--3.2mm
Thickness Tolerance±8%
Minimum line/space0.1mm
Min Annular Ring0.1mm
SMD Pitch0.3mm
Holes 
Min Hole Size(mechanical)0.2mm
Min Hole Size(laser hole)0.1mm
Hole Size Tol (+/-)PTH:±0.075mm;NPTH: ±0.05mm
Hole Position Tol±0.075mm
Plating 
HASL/LF HAL2.5um
Immersion GoldNickel 3-7um Au:1-5u''
Surface FinishHAL,ENIG,Plated Gold,Immersion Gold,OSP
Copper 
Copper Weight0.5--6oz
Color 
Solder maskGreen, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue
Silk screenWhite, Black, Blue,Yellow
Acceptable File FormatGerber file,Powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000
CertificateROSH,ISO9001,UL

 

 

PCB Assembly Capability

 

Stencil Size736x736mm
Minimum IC Pitch0.2mm
Maximum PCB size1200x 500mm
Minimum PCB thickness0.25mm
Minimum chip size:0201 (0.2x0.1)/0603 (0.6 x 0.3mm)
Maximum BGA size:74x74mm
BGA ball pitch:1.00mm (minimum), 3.00mm (maximum)
BGA ball diameter:0.40mm (minimum), 1.00mm (maximum)
QFP lead pitch:0.38mm (minimum), 2.54mm (maximum)
Volume:One piece to low volume production quantities
Low cost first article builds
Schedule deliveries
Assembly type:Surface mount(SMT) assembly
DIP assembly
Mixed(surface mount and through hole) technology
Single or double sided placement
Cable assembly
Components type:Passive components:
As small as 0402 package
As small as 0201 with design review
Ball Grid Arrays(BGA):
As small as .5mm pitch
Parts procurements:Turnkey(we supply the parts)
Consigned(you supply the parts)
You supply some parts, we do the rest
Solder type:Leaded
Lead-free/ROHS compliant
Other capabilities:Repair/rework services
Mechanical assembly
Box build
Mold and plastic injection.

 

 

PCBA Picture

 

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