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FR4 HASL lead free pcb assembly services OEM PCBA Board FR4 indusction cooker

Shenzhen Shinelink Technology Ltd
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[China] country

Address: Room 201 Building A2 Industrial Park No. 6 Yuanchuang Park Rongfu road, Fucheng Street Longhua District Shenzhen City 518131

Contact name:Sandy

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Shenzhen Shinelink Technology Ltd

FR4 HASL lead free pcb assembly services OEM PCBA Board FR4 indusction cooker

Country/Region china
City & Province shenzhen guangdong
Categories Motherboards
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Product Details

FR4 HASL lead free pcb assembly services OEM PCBA Board FR4 indusction cooker

 

Files Requested For PCB Assembly Quotation


---In order to provide you with the most efficient and accurate quote on manufacturing the requested unit, we ask that you provide us with the following information.
1. Gerber file,PCB file,Eagle file or CAD file are all acceptable
2. A detailed bill of materials (BOM)
3. Clear pictures of PCB or PCBA sample for us
4. Quantity and delivery required
5. Test method for PCBA to guarantee 100% good quality products.
6. Schematics file for PCB design if need to do function test.
7. A sample if available for better sourcing
8. CAD files for enclosure manufacturing if required
9. A complete wiring and assembly drawing showing any special assembly instructions if required

 

 

Shinelink kinds PCBA Products

 

 

 

PCB Assembly Capabilities

 

Turnkey PCBAPCB+components sourcing+assembly+package
Assembly detailsSMT and Thru-hole, ISO lines
Lead TimePrototype: 15 work days. Mass order: 20~25 work days
Testing on productsFlying Probe Test, X-ray Inspection, AOI Test, functional test
QuantityMin quantity: 1pcs. Prototype, small order, mass order, all OK
Files we needPCB: Gerber files(CAM, PCB, PCBDOC)
Components: Bill of Materials(BOM list)
Assembly: Pick-N-Place file
PCB panel SizeMin size: 0.25*0.25 inches(6*6mm)
Max size: 20*20 inches(500*500mm)
PCB Solder TypeWater Soluble Solder Paste, RoHS lead free
Components detailsPassive Down to 0201 size
BGA and VFBGA
Leadless Chip Carriers/CSP
Double-sided SMT Assembly
Fine Pitch to 0.8mils
BGA Repair and Reball
Part Removal and Replacement
Component packageCut Tape,Tube,Reels,Loose Parts
PCB assembly
process
Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing

 

 

 

 

 

PCB Feature

 

Number of Layer1 - 20 Layer
Maximum Processing Area680 × 1000MM
Min Board Thickness2 Layer - 0.3MM ( 12 mil )
4 Layer - 0.4MM ( 16 mil )
6 Layer - 0.8MM ( 32 mil )
8 Layer - 1.0MM ( 40 mil)
10 Layer - 1.1MM ( 44 mil )
12 Layer - 1.3MM ( 52 mil )
14 Layer - 1.5MM ( 59 mil )
16 Layer - 1.6MM ( 63 mil )
18 Layer - 1.8MM ( 71 mil )
Finished Board Thickness ToleranceThickness ≤ 1.0MM, Tolerance: ± 0.1MM
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
Twisting and Bending≤ 0.75%, Min: 0.5%
Range of TG130 - 215 ℃
Impedance Tolerance± 10%, Min: ± 5%
Hi-Pot TestMax: 4000V/10MA/60S
Surface TreatmentHASL, With Lead, HASL Free Lead
Flash Gold, Immersion Gold
Immersion Silver, Immersion Tin
Gold Finger, OSP
 

 

About us

 

Shinelink Technology Ltd is more than just a leading PCB manufacturer. We are capable of providing all PCB assembly needs inculding full turnkey and partial turnkey printed circuit board assembly services.

 

For full turn-key, we take care of the entire process, including preparation of Printed Circuit Boards, procurement of components, online order tracking, continuous monitoring of quality and final assembly. Whereas for partial turn-key, the customer can provide the PCBs and certain components, and the remaining parts will be handled by us.

 

FAQ:

 

1. What’s the definition of PCB, PWB and FPC and what’s the difference?

PCB is short for Printed Circuit Board;
PWB is short for Printed Wire Board, same meaning as Printed Circuit Board;
FPC is short for Flexible Printed Board.


2.  What factors should be considered when choosing the material for a PCB board?

Below factors should be considered when we choose the material for PCB:

The material’s Tg value should be greater than the operation temperature;
Low CTE material has good performance of thermal stability;
Good thermal resistance performance: Normally PCBs are required to resist 250℃ for at least 50s.
Good flatness; In consideration of the electrical properties, low loss/high permittivity material is used on high frequency PCB; Polyimide glass fiber substrate used for flexible PCB; Metal core is used when the product has strict requirement of heat dissipation.


3. What’s the merits of O-leading's rIgid-flex PCB?

O-leading’s rigid-flex PCB has the characters of both FPC and PCB, so it can be used in some special products. Some part is flexible while the other part rigid, it can help save product’s interior space, reduce product volume and improve performance.

 

 

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