Active Member
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[China]
Address: Bld#20,NO 88 Lingshan road ,wuzhong district,suzhou, jiangsu ,China
Contact name:Mini
Phoenix (suzhou) electronic Co.,ltd |
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Application Introduction:
Bulb lamp is a new type of energy-saving lamp to replace the traditional incandescent bulb. The traditional incandescent lamp (tungsten filament lamp) has high energy consumption and short service life. In the environment of global resource shortage, it has been gradually banned by governments. Then the alternative product is electronic energy-saving lamp. Although electronic energy-saving lamp improves the energy-saving effect, it is contrary to the general trend of environmental protection due to the use of many heavy metal elements that pollute the environment
High brightness 18v 30ma SMD LED 2835 for bulb lamp
Quick details:
| Input Voltage(V): | 18V |
| Warranty(Year): | 2-Year |
| Type: | Smd Led Chip 2835 |
| Lighting solutions service: | Lighting and circuitry design |
| Luminous Efficacy(lm/w): | 160lm/w |
| Lifespan (hours): | 50000 |
| Working Time (hours): | 20000 |
| Chip Material: | INGAN |
| Emitting Color: | 3000K 4000K 6500K |
| Power: | 0.5W |
| Viewing Angle(°): | 120 Degree |
| Color Rendering Index(Ra): | 80 |
| Packing bag: | 220*240nm |
| Place of Origin: | Suzhou ,jiangsu |
| Application: | LED STRIP |
| Package Type: | Suface Mount Package |
| Forward Current: | 30MA |
| Size: | 2.8*3.5*0.65mm |
| Packing: | 4000 Pcs/Roll |
Product specification:
Package Structure
Absolute Maximum Ratings
| Power dissipation | PD | 0.5 | W |
| Continuous forward current | IFmax | 30 | mA |
| Peak forward current (1/10 duty cycle 10ms pulse width) | IFP | 40 | mA |
| Item | Symbol | Maximum | Unit |
| Reverse voltage | VR | 5 | V |
| Electrostatic Discharge (HBM) | ESD | 2000 | V |
| Operating temperature range | Topr | -40 to +85 | ℃ |
| Storage temperature range | Tstg | -40 to +85 | ℃ |
| Led yunction temperature | Tj | 120 | ℃ |
Optical/Electrical Characterization:
| CCT | STEPS | x | y | a | b | θ |
| ERP F6500 | 1 | 0.313 | 0.337 | 0.00223 | 0.00095 | 58.383 |
| ERP F5000 | 1 | 0.346 | 0.359 | 0.00274 | 0.00118 | 59.617 |
| ERP F4000 | 1 | 0.38 | 0.38 | 0.00313 | 0.00134 | 54 |
| ERP F3000 | 1 | 0.44 | 0.403 | 0.00278 | 0.00136 | 53.167 |
| ERP P2700 | 1 | 0.463 | 0.42 | 0.00258 | 0.00137 | 57.283 |
| CCT | STEPS | CX | CY | a | b | theta |
| 2700K | 1 | 0.4578 | 0.4101 | 0.0027 | 0.0014 | 53.7 |
| 3000K | 1 | 0.4338 | 0.403 | 0.00278 | 0.00136 | 53.22 |
| 3500K | 1 | 0.4073 | 0.3917 | 0.00309 | 0.00138 | 54 |
| 4000K | 1 | 0.3818 | 0.3797 | 0.00313 | 0.00134 | 53.72 |
| 5000K | 1 | 0.3447 | 0.3553 | 0.00274 | 0.00118 | 59.62 |
| 5700K | 1 | 0.3287 | 0.3417 | 0.00249 | 0.00107 | 59.09 |
| 6500K | 1 | 0.3123 | 0.3282 | 0.00223 | 0.00095 | 58.57 |
Typical Electro-Optical characteristics curves:
LED Reliability Test List
| No. | Item | Test Conditions | Test hr/cycle/time | Sample Q’ty | Ac∕Re | |
| 1 | Solder Heat | TEMP:260℃±5℃；5±1 sec | 2 times | 30 pcs | 0∕1 | |
| 2 | Solder ability Test ※ | TEMP:235℃±5℃；3±1 sec | 1 time | 5 pcs | 0∕1 | |
| 3 | Temperature Cycle | H:+100℃ 30min. ∫5min. L:-40℃ 30min. | 100 cycles | 20 pcs | 0∕1 | |
| 4 | Thermal Shock | H:+100℃ 5min. ∫ L:-40℃ 5min. | 50 cycles | 20 pcs | 0∕1 | |
| 5 | High Temperature Storage | TEMP:100℃ | 1000 hrs | 20 pcs | 0∕1 | |
| 6 | Low Temperature Storage | TEMP:-40℃ | 1000 hrs | 20 pcs | 0∕1 | |
| 7 | DC Operating Life | IF＝IFmax | 1000 hrs | 20 pcs | 0∕1 | |
| 8 | High Temperature High Humidity | 85℃∕85％R.H. | 1000 hrs | 20 pcs | 0∕1 | |
| 9 | Shocking test | 100～2000Hz ；98.1m/s2 X,Y,Z direction | 2 hrs | 20 pcs | 0∕1 | |
| 10 | Dropping test | Put on pallet ；height:75cm | 3 times | 20 pcs | 0∕1 | |
| Judgment Criteria | ||||||
| Forward Voltage VF | VF Max-Increase < 1.1x | |||||
| Reverse Current IR | IR Max-Increase < IRmax | |||||
| Luminous Intensity IV | IV Decay < 40% | |||||
※Solder ability test criteria:coverage is not less than 95% Note:Measurement shall be taken after the tested samples have been returned to normal ambient conditions (generally after two hours) | ||||||
Packaging:
Cautions:
The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
Top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions Should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle,The pressure on the silicone resin should be proper.
Soldering iron :
When hand soldering, the temperature of the iron must less
than 300℃ for 3 seconds
The hand solder should be done only one times
SMT Reflow Soldering Instructions SMT :
Reflow soldering should not be done more than two times
When soldering , do not put stress on the LEDs during heating
The recommended reflow soldering profile as following
Handling Precautions :
Handle the component along the side surface by using forceps or
appropriate tools
Do not directly touch or handle the silicone lens surface. It may
damage the internal circuitry
Do not stack together assembled PCBs containing LEDs. Impact may
scratch the silicone lens or damage the internal circuitry
Product features:
Adopt good quality chip and frame ,antistatic good stability Ultra low attenuation
High brightness ,low attenuation high color rendering
Minimum 70,80,90 95 CRI options
Strong welding and good stability undead light
Product series and company logo on the front
CE ROHS LM80 Certification
Production Process:
