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Metal Core Prototype PCB Board For LED Lighting Industry

Shenzhen Yizhuo Electronics Co., Ltd
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Shenzhen Yizhuo Electronics Co., Ltd

Metal Core Prototype PCB Board For LED Lighting Industry

Country/Region china
Categories Mobile Phone Chargers
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Product Details

Led Lighting Pcb Electronic Pcb Board Prototype Pcb Board Metal Core Pcb

 

ItemUnit SpecificationTest Condition
Insulation ThicknessµmMax
Min
200
60
-
Solder Resistance (288°C)Sec.Min600IPC-TM-650 2.4.13.1
Thermal Shock288°C * 10"/cycleMin6 TimesIPC-TM-650 2.4.13.1
Peel Strength (Normal status)lb/inMin9IPC-TM-650 2.4.8
Breakdown VoltageV/mil 750IPC-TM-650 2.5.6
Volume Resistivity (Normal status >E+14)Ω * cm 1.8x1015IPC-TM-650 2.5.17.1
Surface Resistivity (Normal status >E+12)Ω 3.5x1014IPC-TM-650 2.5.17.1
Dielectric Constant
1 MHz Normal Status
1 GHz Normal Status
- 
5.6
5.3
IPC-TM-650 2.5.5.3
IPC-TM-650 2.5.5.5
IPC-TM-650 2.5.5.6
Dissipation Factor
1 MHz Normal Status
1 GHz Normal Status
  
0.013
0.010
IPC-TM-650 2.5.5.3
IPC-TM-650 2.5.5.5
IPC-TM-650 2.5.5.9
Water Absorption% 0.2IPC-TM-650 2.6.2.1
Thermal Conductivity
(measured on insulation layer only)
W/m°C 1.0ASTM-E1461
Flammability94V-0 PassIPC-TM-650 2.3.9
Tg°C 100IPC-TM-650 2.2.24
Td°C 410TBD (5wt% loss)
MOT (RTI)°C 130UL 746B
CTI (Comparative Tracking index)V 600 (PLC=0)UL 746E DSR

Technical Parameters
Layer count: 2
Board thickness:1.6mm
Dimension:650*10mm
Raw material:Aluminum base, thermal conductivity 1.0w
Copper thickness on the board surface:≥45um
Copper thickness in the hole barrel:25um
Min.line width/space:0.22mm
Minimum hole diameter:0.4mm
Surface finishing:OSP/HASL


Application: LED lighting

Structure of Aluminum PCBs:

Aluminum PCBs are aluminum based CCLs (CCL is a type of base material of PCBs). AluminumPCBs are actually quite similar to FR4 PCBs. The basic structure of Aluminum PCBs is four layered. It consists of a layer of copper foil, a dielectric layer, an aluminum base layer and aluminum base membrane.

 
  • Copper Foil Layer: the copper layer used is relatively thicker than normal CCLs ( 1oz-10oz). A thicker layer of copper means a larger current carrying capacity.
  • Dielectric Layer:the Dielectric layer is a thermally conductive layer and is around 50μm to 200μm thick. It had a low thermal resistance and it suitable for its application.
  • Aluminum Base: The third layer isthe aluminum base which is made up of aluminum substrate. It has a high thermal conductivity.
  • Aluminum Base Membrane Layer: Aluminum base membrane is selective. It has a protective role by keeping the aluminum surface safe from scraping and unwanted etching. It is of two types i.e. Lower than 120 degree or around 250 degrees (anti high temperature)

 

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