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PCB 5 Zones SMT Reflow Oven Vacuum Package Lead Free Equipment
SMT PCB Reflow Oven 5 Zones Vacuum Package Lead Free Equipment
Features of 5 zones reflow oven
1. The upper cover of the oven is raised by electric handspike, safe and credible
2. SMEMA compatible
3. Even temperature and high heat compensation efficiency,
especially suitable for soldering of BGA CSP components.
4. Quick warm up, it takes less than 20 minutes to heat fromthe normal temperature to the working temperature.
5. The guide rail is made of special aluminum alloy with high rigidity accuracy and intensity, with auto chain lubricating system.
6. Powerful programming software’s controlling system, it can
detect the online temperature
of PCB and can analysis save and print the profiles.
7. All temperature zone applies coercive independent cycles PID
controls and up & down heating style,
which make the temperature of theoven accurate with a large heat
capacity.
8. The patent wind wheel design can ensure wind speed windspeed can be adjusted by frequency conversion.
Specifications of 5 zones reflow oven
| Model | RF-500I |
| Temperature Deviation on PCB | ± 1.5C |
| No. of Cooling Zones | 1 |
| Components Clearance | Top / Bottom Clearance of PCB is 25mm |
| Max. Width of PCB | 50 ~ 400 MM |
| Temperature Control Precision | ± 1C |
| Length of Heating Zones | 2250 MM |
| Nozzle Plate | Stainless Steel Plate |
| Cooling Method | Air Oven : Forced Air; Nitrogen Oven : Water Chiller |
| Conveyor Direction | Option |
| No. of Heating Zones | Top 5 & Bottom 5 |
| Conveyor Height | 900± 20 MM |
| PCB Conveyor Method | Mesh and Rails |
| Startup Power | Approx. 24KW |
| Convryor Speed | 20-2000MM/min |
| Mesh Width | 450 MM |
| Power Supply | 380V 50HZ / 220V 60HZ |
| Normal Operation Power | About 3KW |
| Temp. Setting Range | Rome Temperature ~320C |
| Dimension ( L*W*H ) | 4150*1300*1450 |
| Weight | 1350KG |
What’s the function of Reflow Oven ?
The function of reflow oven is to send the mounted circuit board of the SMT components into the SMT reflow oven chamber. After high temperature, the solder paste used for soldering the SMD components is melted by the process of high temperature hot air to form a reflow temperature change, so that the SMD components and The pads on the circuit board are combined and then cooled together.
Product Introduction of 5 zones reflow oven
Lead-free reflow oven changdian's mature product after years of market testing. Series Reflow oven has maintained a larger share of the market for many years. Its unparalleled heating performance and temperature control system meets the requirements of various welding processes.
It is changdian's crystallization of years technical research and
development. Series Lead-free reflow is high-end reflow products
committed to keeping up with market demand to enhance customers
competitiveness.Its new design concept fully meets the needs of
increasingly diverse processes, And considering the future
direction of the industry, entirely suitable for communications,
automotive electronics, home appliances, computers and other
consumer electronic products.
About the package
