BGA CSP Components Reflow Oven 50mm PCB Machine for SMT Production Line

SMT Lead Free SMT Machine 5 Zones Reflow Oven

Features

1. All temperature zone applies coercive independent cycles PID controls and up & down heating style,

    which make the temperature of theoven accurate with a large heat capacity.

2. Even temperature and high heat compensation efficiency,

    especially suitable for soldering of BGA CSP components.

3. Automatically monitoring and displaying the working condition of the oven the parameter

   of the oven can be modified at any moment

4. The patent wind wheel design can ensure wind speed windspeed can be adjusted by frequency conversion

5. Quick warm up, it takes less than 20 minutes to heat fromthe normal temperature to the working temperature.

6. Powerful programming software’s controlling system, it can detect the online temperature

    of PCB and can analysis save and print the profiles.

7. The upper cover of the oven is raised by electric handspike, safe and credible.

8. The guide rail is made of special aluminum alloy with high rigidity accuracy and intensity,

    with auto chain lubricating system

9. SMEMA compatible

Specifications

Company Picture

Package and Shippment

Package : vacuum packing and wooden packing.

Shippment : 

1. By air. 

2. By sea. 

3. By truck. 

4. Other method as you like.