Component Reliability Improvement Certification for Electronic Components

Failure analysis of electronic components
Basic introduction
The rapid development of electronic component technology and the improvement of reliability have laid the foundation for modern electronic equipment. The fundamental task of component reliability work is to improve the reliability of components. Therefore, it is necessary to attach importance to and accelerate the development of component reliability analysis work, determine the failure mechanism through analysis, find out the cause of failure, and feedback to design, manufacturing and use, jointly study and implement corrective measures to improve the reliability of electronic components.
The purpose of failure analysis of electronic components is to confirm the failure phenomenon of electronic components with the help of various test analysis techniques and analysis procedures, distinguish their failure mode and failure mechanism, confirm the final cause of failure, and put forward suggestions for improving design and manufacturing processes to prevent the recurrence of failure and improve component reliability.
Service objects
Component manufacturers: deeply involved in product design, production, reliability testing, after-sales and other stages, and provide customers with theoretical basis for improving product design and process.
Assembly plant: divide responsibilities and provide basis for claims; improve production process; screen component suppliers; improve testing technology; improve circuit design.
Device agent: distinguish quality responsibility and provide basis for claims.
Machine users: Provide a basis for improving the operating environment and operating procedures, improve product reliability, establish corporate brand image, and improve product competitiveness.
Significance of failure analysis
1. Provide a basis for electronic component design and process improvement, and guide the direction of product reliability work;
2. Identify the root causes of electronic component failure, and effectively propose and implement reliability improvement measures;
3. Improve the yield rate and reliability of finished products, and enhance the core competitiveness of the enterprise;
4. Clarify the responsible party for product failure and provide a basis for judicial arbitration.
Types of components analyzed
Integrated circuits, field effect tubes, diodes, light-emitting diodes, triodes, thyristors, resistors, capacitors, inductors, relays, connectors, optocouplers, crystal oscillators and other active/passive devices.
Main failure modes (but not limited to)
Open circuit, short circuit, burnout, leakage, functional failure, electrical parameter drift, unstable failure, etc.
Common failure analysis techniques
Electrical testing:
Connectivity test
Electrical parameter test
Function test
Non-destructive analysis technology:
X-ray perspective technology
Three-dimensional perspective technology
Reflection scanning acoustic microscopy (C-SAM)
Sample preparation technology:
Opening technology (mechanical opening, chemical opening, laser opening)
Passivation layer removal technology (chemical corrosion removal, plasma corrosion removal, mechanical grinding removal)
Micro-area analysis technology (FIB, CP)
Microscopic morphology technology:
Optical microscopic analysis technology
Scanning electron microscope secondary electron image technology
Failure location technology:
Microscopic infrared thermal imaging technology (hot spot and temperature mapping)
Liquid crystal hot spot detection technology
Emission microscopic analysis technology (EMMI)
Surface element analysis:
Scanning electron microscopy and energy spectrum analysis (SEM/EDS)
Auger electron spectroscopy (AES)
X-ray photoelectron spectroscopy (XPS)
Secondary ion mass spectrometry (SIMS)