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Customizable FPC / PCB Laser Depaneling Machine , PCB Laser Cutting Machine SMTfly-5S

Shenzhen SMTfly Electronic Equipment Manufactory Ltd
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Address: Building 2, Gang Hua Xing Industrial Park, Chongqing Road, Fuyong Town, Shenzhen, China 518103

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Shenzhen SMTfly Electronic Equipment Manufactory Ltd

Customizable FPC / PCB Laser Depaneling Machine , PCB Laser Cutting Machine SMTfly-5S

Country/Region china
City & Province shenzhen chongqing
Categories Electronics Production Machinery
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Product Details

 

Customizable FPC/PCB Laser Depaneling Machine,PCB Laser Cutting Machine,SMTfly-5S Features:

  1. High precision CCD automatic positioning, automatic focusing;
  2. Fast and accurate positioning, save time and no worries;
  3. Friendly interface,Simple operation, easy to use, free application;
  4. Small size, Save more space;
  5. rigorous security design;
  6. Reduce energy consumption;
  7. Cost savings;
  8. Cost-effective, fast cutting speed,stable performance.

 

Advantages of Laser PCB Depaneling/Singulation Machine:      

 

  • No mechanical stress on substrates or circuits
  • No tooling cost or consumables.
  • Versatility – ability to change applications by simply changing settings
  • Fiducial Recognition – more precise and clean cut
  • Optical Recognition before PCB depaneling/singulation process begins.
  • Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)
  • Extraordinary cut quality holding tolerances as small as < 50 microns.
  • No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards      

 

Application for Laser PCB Depaneling Machine:

 

  1. FPC and some relative materials;
  2. FPC/PCB/ Rigid‐Flex PCB cutting,
  3. Camera module cutting.

 

Customizable FPC/PCB Laser Depaneling Machine,PCB Laser Cutting Machine,SMTfly-5S:

 

PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.

 

UV Laser Cutting Machine for FPC DepanelingSpecification:

 

Technical ParameterMain body of laser1480*1360*1412
Weight1500KG
Laser355nm
LaserOptoware 10W (US)
Material≤1.2mm
Precision±20μm
Platform±2μm
Working Area600*450mm
Maximum3KW
VibratingCTI(US)
PowerAC220V
Diameter20±5μm
Ambient20±2℃
Ambient< 60%
The Machine

Marble

 

        

 Fully-Automatic Laser Cutting and Sorting System for FPC:

 

                

 

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