Active Member
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[China]
Address: Building 2, Gang Hua Xing Industrial Park, Chongqing Road, Fuyong Town, Shenzhen, China 518103
Contact name:
Shenzhen SMTfly Electronic Equipment Manufactory Ltd |
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Automatic Inline SPI-Solder Paste Inspection Machine,SMTfly-V700 Features:
Red glue detection
This device, in addition to supporting common 3D solder paste inspection, can also detect red rubber process at the same time, supporting missed printing, overflowing plastics, multiple adhesives, and low adhesives, etc., and displaying full-color defective image. Positioning.
Bare-board learning programming
No Gerber and CAD files are required, as long as a bare board is provided, automatic learning programming can be realized. The software automatically extracts the detection frame data, and the user edits it appropriately, and sets detection parameters and allowable values.
Automatic plate bend compensation
The three-dimensional plate bending compensation technique is used to perform surface fitting on the discrete reference points in the FOV to perform real-time compensation during the detection process. There is no need to move the Z axis and the detection speed is faster.
Camera bar code recognition
The camera can automatically identify the bar code (one-dimensional/two-dimensional) of the inspection surface on the PCB to facilitate trace ability of product quality.
Offline programming and debugging
The remote programming can be done by using offline programming software to import Gerger, CAD, etc. The programming time does not exceed 5 minutes.
Detection frame can be adjusted at any time
The size and shape of openings in some gerber files may not be exactly the same as openings in the stencil. In this case, the data (position, size, shape, etc.) of the detection frame can be manually adjusted through the learning mode.
Automatic Inline SPI-Solder Paste Inspection Machine,SMTfly-V700 Specification:
| Category | Item | Specifications | ||
Inspection System | Camera | Full digital high speed CCD camera, 5 million pixels | ||
| Light source | Ring LED light source | |||
| FOV | 29mm*29mm(18μm) | |||
| Processing time per picture | <0.6s | |||
| Test content | Paste printing / red plastic printing: volume, area, height, shape, offset, continuous tin, overflow glue | |||
| Defect Types | Yes, Offset, Multi-Tin, Less Tin, Continuous Tin, Tip, Collapse, Alien, Gold finger, Insufficient Height, Height Exceeded, Overfill, Insufficient, etc. | |||
| Paste height range | 30~400um | |||
| Paste size range | 0.15mm×0.15mm~10mm×10mm | |||
| Height detection accuracy | 1μm (based on actual solder paste and 3D correction block) | |||
| Repeat ability (volume/area/height) | <1μm@3sigma | |||
| Repeat ability & Reproduce ability | <10% | |||
Software System | Operating System | Windows 7 | ||
Identification System | Features | 3D bidirectional raster projection head (single head optional), no shadow 3D detection | ||
| Operational interface | Graphical programming, easy operation, switchable English, traditional and simplified systems | |||
| Interface display | 2D/3D color map | |||
| MARK | can select 2 common Mark points, multi-Mark function can be selected in the puzzle, and Bad Mark function is supported | |||
| Programming | Support Gerber, CAD import, support offline programming and manual programming | |||
| SPC | Offline SPC | Support | ||
| SPC Report | Anytime Report | |||
| Histogram/control chart | Volume,area, height, offset | |||
| Exportable Content | Reports (Excel), Pictures (jpg, bmp)
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