Wire bonding inspection equipment SMT Equipment WEBER 3D AOI
Equipment Characteristics
1.High-density marble platform provides assurance for
high-precision
2.Multi-angle light sources combined with high-resolution cameras
and telecentric lenses greatly enhance detection results
3.The latest self-developed AAM absolute precision measurement
system,accurately detects wire aluminum and wire bonding defects
AI Detection System
Trainning images}}AI deep neural network}}AI model}}Test results
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Products to be inspected
3D Detectlon
1.Having complete WB 3D imaging capability
2.Multi-layer focusing function,infinite depth of field,clear
imaging across the entire board
3.Zero-negative sample AI detection,exclusive in the
industry,complex appearance defect capability
EQUIPMENT PARAMETERS
Model | | WB-3D |
Vision system | Camera | Standara:1200w;Optional:2100W/6500W |
| Resolution | 2.7μm/1.8μm |
| FOV size | 11mm*8.25mm |
| IIIumination | RGBW LED |
Hardware | Power Supply | 200V-230V AC50/60Hz |
| Power | 2.2KW |
| Pressure | 0.4-0.6MPa |
| Weight | 1100kg |
| Equipment size | W1156*D1475*H1650 |
Check specifications | Substrate size | 50*50~510*460mm |
| PCB thickness | 0.6~6mm |
| Measure height | Components measurable up to a maximum height of 30mm |
Optional function | Artificial intelligence | ALBig Data Training Center |
| Auxiliary function | Remote centralized review,Barcode reading,OCR recognition |
Inspection items | Appearance inspection | Bad wire arc,bad solder joints,oxidation pollution,foreign
matter,scratches...... |