Featured Products: Ceramic Optoelectronics Hermetic High Power Laser Package, 42 Alloy Housing Hermetically Sealed Electronic Packages, 2 Pin Laser Diode Hermetic High Power Laser Package and more.
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Main performance parameters Application field: pump laser package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm Gold layer thickness: >0.45μm ...
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| [Last Updated : 2024-04-11] |
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Product name: Suitable Deep Drawing 42 Alloy Housing Leads Perpendicular To The Substate Mounting Surface Finish: Fully plating Au or selective plating Au Plating: Package is ...
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| [Last Updated : 2024-04-11] |
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Main performance parameters Application field: Pump laser package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm Gold layer thickness: >0.45μm ...
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| [Last Updated : 2024-04-11] |
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Main performance parameters Application field: Pump laser package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm Gold layer thickness: >0.45μm ...
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| [Last Updated : 2024-04-11] |
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Technical characteristics: Product: Micro channel heat sink Size: 27.00 x 10.80 x 1.50 mm Flatness of chip mounting area: ≤ 2 um Roughness of chip mounting area: ≤ 0.3 um Plating ...
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| [Last Updated : 2024-04-24] |
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Main performance parameters Application field: Pump laser package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm Gold layer thickness: >0.45μm ...
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| [Last Updated : 2024-04-24] |
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Main performance parameters Application field: Pump laser package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm Gold layer thickness: >0.45μm ...
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| [Last Updated : 2024-04-24] |
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Main performance parameters Application fields: ICR package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm ...
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| [Last Updated : 2024-04-11] |
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Main performance parameters Application fields: WSS package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm ...
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| [Last Updated : 2024-04-11] |
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Main performance parameters Application fields: Optical Switch And Optic Fiber Gyroscope Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold ...
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| [Last Updated : 2024-04-11] |
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Main performance parameters Application fields: VOA -Switch- Wavelocker package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating ...
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| [Last Updated : 2024-04-11] |
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Main performance parameters Application fields: optical communication module package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating ...
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| [Last Updated : 2024-04-11] |
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Product name: Fiber optic electronic component housing Material: Housing kovar ring; kovar lead; base Wcu ; ceramic insulator. Finish: Fully plating Au.(Finish could adopt fully ...
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| [Last Updated : 2024-04-11] |
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Main performance parameters Application fields: TOSA-ROSA package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm ...
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| [Last Updated : 2024-04-11] |
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Main performance parameters Application fields: Modulator package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm ...
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| [Last Updated : 2024-04-11] |
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Main performance parameters Application fields: Optical communication package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating ...
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| [Last Updated : 2024-04-11] |
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Main performance parameters Application fields: Optical communication package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating ...
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| [Last Updated : 2024-04-11] |
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Main performance parameters Application fields: Optical communication package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating ...
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| [Last Updated : 2024-04-11] |
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Main performance parameters Application fields: Optical communication package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating ...
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| [Last Updated : 2024-04-11] |
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Main performance parameters Application fields: Optical communication package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating ...
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| [Last Updated : 2024-04-11] |
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