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JEDEC Standard LGA IC Semiconductor Tray HIPS Materials Non ESD

Shenzhen Hiner Technology Co.,LTD

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Address: Building A11,Zone D,West Industrial Zone,Minzhu Community, Date: 2022-7-15 Shajing Street,Baoan District,Shenzhen City,GD Province CN

Contact name:Rainbow Zhu

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JEDEC Standard LGA IC Semiconductor Tray HIPS Materials Non ESD

Country/Region china
City & Province shenzhen guangdong
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Product Details

JEDEC Standard LGA IC Semiconductor Tray HIPS Materials Non ESD
 
Customized JEDEC Standard Design Tray For LGA IC Parts
 
Detail description
 
Outline Line Size322.6*135.9*12.19mmBrandHiner-pack
ModelHN1979Package TypeLGA IC
Cavity Size77*84*4.8mmMatrix QTY1*3=3pcs
MaterialHIPSFlatnessMAX 0.76mm
ColorBlackServiceAccept OEM,ODM
ResistanceN/ACertificateROHS

 

The design of the structure and shape in line with JEDEC international standards can also perfectly meet the requirements of the carriing components or IC of the tray, carriing function to meet the requirements of the automatic feeding system, to achieve the modernization of loading, improve work efficiency.

 

The tray has a 45-degree chamfer to provide the visual indicator of Pin 1 orientation of the IC and prevent the stack of errors, reduce the possibility of workers making mistakes and maximize the protection of the chip.

 

Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing IC but also better protect the chip storage.We have designed a lot of packaging way, which also contains common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC and SiP, etc.We can provide custom service for all packaging methods of chip tray.

 

Product Application

 

Package IC PCBA module component

Electronic component packaging Optical device packaging


Packaging


Packaging Details:Packing according to customer's specified size Semiconductor Tray

MaterialBake TemperatureSurface Resistance
PPEBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon FiberBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon PowderBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Glass FiberBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
PEI+Carbon FiberMax 180°C1.0*10E4Ω~1.0*10E11Ω
IDP Color85°C1.0*10E6Ω~1.0*10E10Ω
Color, temperature and other special requirements can be customized

FAQ


1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.

2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.

3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept
EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.

5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.

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