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Integrated Circuit Chip EP2C35F672C7 Field Programmable Gate Array 672-FBGA IC Chip

ShenZhen Mingjiada Electronics Co.,Ltd.

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Address: 1239 New Asia Guoli Building Zhenzhong Road.,Futian district Shenzhen China

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Integrated Circuit Chip EP2C35F672C7 Field Programmable Gate Array 672-FBGA IC Chip

Country/Region china
City & Province shenzhen
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Product Details

 Integrated Circuit Chip EP2C35F672C7 Field Programmable Gate Array 672-FBGA IC Chip​

 

Product Description Of EP2C35F672C7

EP2C35F672C7 Cyclone II devices support the Nios II embedded processor which allows you to implement custom-fit embedded processing solutions.

 

Specification Of EP2C35F672C7

Part NumberEP2C35F672C7
Number of LABs/CLBs
2076
Number of Logic Elements/Cells
33216
Total RAM Bits
483840
Number of I/O
475
Voltage - Supply
1.15V ~ 1.25V
Mounting Type
Surface Mount


Features Of EP2C35F672C7

  • Advanced I/O support
  • Single-ended I/O standard support, including 2.5-V and 1.8-V
  • High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL, differential HSTL, and differential SSTL

 

Other Electronic Components In Stock

Part NumberPackage
AD7401YRWZSOP16
BCM54640B0KFBGBGA
SM661GE8BGA
TSB81BA3EPFPHTQFP80
VN7020AJTRSSOP16
LP3943ISQWQFN24

 

FAQ

Q: Are your products original?
A: Yes, all products are original, new original import is our purpose.
Q: Which Certificates do you have?
A: We are ISO 9001:2015 Certified Company and member of ERAI.
Q: Can you support small quantity order or sample?Is the sample free?
A: Yes,we support sample order and small order.Sample cost is different according to your order or project.
Q: How to ship my order? Is it safe?
A: We use express to ship,such as DHL,Fedex,UPS,TNT,EMS.We can also use your suggested forwarder.Products will be in good packing and ensure the safety and we are responsible to product damage to your order.
Q: What about the lead time?
A: We can ship stock parts within 5 working days.If without stock,we will confirm lead time for you based on your order quantity.

 

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