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Address: No. 6 Huanglongshan South Rd, Wuhan 430205, P.R.China
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Tiny Size Uncooled Infrared Camera Core 640x512 12um for UAV Payloads
As a leading manufacturer of cooled uncooled infrared detectors & thermal modules, Global Technology developes a tiny size and lightweight infrared thermal imaging core iTL612R Pro, which is the compact version of infrared camera core iTL612R.
Fully oriented for SWaP-C (size-weight-and- power-cost), the size and weight of iTL612R Pro infrared camera core has already been at the forefront in the industry.It is the best choice for customers who have restrict requirements on size and weight when integrating their own drones.
Providing 640×512/12μm self-developed wafer-level infrared detector, lens protection grade IP67, imaging and temperature measurement version, and various SDK solutions, the iTL612R Pro thermal module responds to space constraints with smaller size and lighter weight, achieves longer battery life with lower power consumption, overcomes integration problems in the consumer electronics field, and provides more solutions for compact and portable products.
It is specially developed for the field of Predictive Maintenance, Photovoltaic Inspection, Environmental Protection, Scientific Research, Aerial Photography, Police Investigation, Disaster Relief & Rescue, Forest Fire Prevention, Urban Safety etc.
Compact & Lightweight Design
• Size: 17mm×17mm×22mm (with 9.1mm lens)
• Weight: 13g (with 9.1mm lens)
• Power consumption as low as 0.7W
Clear Image & Accurate Radiometry
• Brand new image process algorithm: NUC/3DNR/DNS/DRC/EE
• Support Windows/Linux/ARM SDK
• Support regional, point & isotherm temperature measurement
Various Interfaces for Easy Integration
• DVP/LVDS/USB2.0 interfaces, RAW/YUV image data output, serial
port control
| Model | iTL612R Pro |
| IR Detector Performance | |
| Sensitive Material | Vanadium Oxide |
| Resolution | 640×512 |
| Pixel Size | 12μm |
| Spectral Range | 8~14μm |
| Typical NETD | ≤40mk |
| Image Processing | |
| Frame Rate | 30Hz |
| Start-up Time | 5s |
| Digital Video | RAW/YUV/BT656 |
| Image Algorithm | Non-uniformity Correction (NUC) 3D Noise Reduction (3DNR) De-noise (DNS) Dynamic Range Compression (DRC) Edge Enhancement (EE) |
| Image Display | Black Hot/White Hot/Pseudo Color |
| PC Software | |
| ICC Software | Module Control & Video Display |
| Electrical Specifications | |
| Standard External Interface | 30Pin_HRS: DF40C-30DP-0.4V(51), (HRS, Male) |
| USB Expansion Board | Type-C |
| Communication Interface | RS232-TTL/USB2.0 |
| Digital Video Interface | CMOS8/USB2.0 |
| Supply Voltage | 4.0-5.0V V VDC |
| Typical Power Consumption | 0.7W |
| Temperature Measurement | |
| Operating Temperature Range | -10°C~+50°C |
| Temperature Measurement Range | -20°C~+150°C, 0°C~550°C; Support Customization and Expansion |
| Temperature Measurement Accuracy | Greater of ±2°C or ±2% (@23℃±3℃) |
| Regional Temperature Measurement | Support Maximum, Minimum and Average Value of the Output Regional Temperature |
| SDK | Support Windows/Linux/ARM; Achieve Video Stream Analysis and Conversion from Gray to Temperature |
| Physical Characteristics | |
| Size (mm) | 17×17×22 (With 9.1mm Lens) |
| Weight | 13g (With 9.1mm Lens) |
| Environmental Adaptability | |
| Operating Temperature | -40°C~+70°C |
| Storage Temperature | -45°C~+85°C |
| Humidity | 5%~95%, Non-condensing |
| Vibration | 5.35grms, 3 Axis |
| Shock | Half-sine Wave, 40g/11ms, 3 Axis 6 Direction |
| Certificates | ROHS2.0/REACH |
| Optics | |
| Optional Lens | Fixed Focus Athermal: 9.1mm |
The iTL612R Pro thermal imaging module can be integrated into UAV
payloads and wearable devices so that is widely used in fields
of Predictive Maintenance, Photovoltaic Inspection, Environmental
Protection, Scientific Research, Aerial Photography, Police
Investigation, Relief & Rescue, Forest Fire Prevention, Urban
Safety etc.
1. What is infrared detector / thermal imaging sensor?
Infrared waves cannot be seen with the human eye. Infrared detector / thermal imaging sensor is an optical-electrical device to react to infrared radiation and thermal energy and convert it into electrical signal and then output visible thermal images.
2. What is WLP?
WLP refers to wafer level package. It is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared sensor. Together with metal package, ceramic package, they are the 3 main package formats of uncooled infrared detectors.
3. What's the advantage of WLP?
WLP IR detectors are specially designed to meet the miniaturization and low cost requirement in the application of infrared technology to consumer electronics market. Global Sensor Technology, with volume fabrication capability, is now offering a variety of WLP infrared module solutions to boost more new applications of emerging markets.
