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5274 Two Component Thermal Gel Gap Filler Able To Cure At Room Temperature Or Accelerate Curing At High Temperature

Shanghai Huitian New Material Co., Ltd

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5274 Two Component Thermal Gel Gap Filler Able To Cure At Room Temperature Or Accelerate Curing At High Temperature

City & Province shanghai shanghai
Categories Chemical Stocks
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Product Details

 

5274 is a two-component silicone thermal conductive gel, which be able to cure at room temperature or accelerate curing at high temperature

 

Product Description

  • Silicone thermal conductive composite
  • Blue/white gel
  • 1:1 mixture of two components

 

 

Product Features:

  • Thermal conductivity: 4.0 W/m∙K
  • Excellent workability
  • Curing at room temperature or accelerated curing at high temperature
  • Low static/transient stress on substrates
  • High reliability under various conditions

 

 

Technical Parameters

StandardsItemsUnitValues
VisualAppearance (A/B)-
Blue/white
ASTM D792Density (A/B)g/ml
3.2/3.2
/Mix ratio-1 :1 (W/W)
ASTM D2196ViscosityPa·s
250 ±100
ASTM D5470Thermal conductivityW/(m·K)
4.0
ASTM D5470
Thermal Impedance℃·cm2 /W0.43
ASTM D257Volume resistivity

 

Ω·cm

1.0×1012
ASTM D149Dielectric strengthKV/m15
UL94Flame rating-V-0
Operating temperature-40-200
Operating time @ 25℃min>60
/

Cure time @ 25℃

h8
Cure time@120℃min20

 

Main Applications:

  • Heat dissipation of lithium battery packs in new energy vehicles
  • Heat dissipation of battery packs in energy storage power stations
  • Automotive electronic equipment
  • Large storage devices
  • Communication equipment

 

Packing:

400ml/cartridge; 25kg/barrel; 298kg/drum

 

Storage:

Store at 8-25°C in a cool and dry place.

Shelf life is 6 months.

 
 

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