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Diamond Grinder Blade Resin Bond Abrasives For Sapphire Ingot

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Diamond Grinder Blade Resin Bond Abrasives For Sapphire Ingot

Country/Region china
City & Province hainan hainan
Categories Ingots
InquireNow

Product Details

Diamond Grinder Blade Resin Bond Abrasives For Sapphire Ingot

 

Diamond grinding wheel is used to process and trim the external circle of the sapphire ingot to obtain precise external circle dimensional accuracy and edge shape and the oriented-side plane(OF plane) of sapphire ingot by grinding the reference edge.

 

 

Main features

High sharpness---high processing efficiency for hard and brittle materials such as sapphire.

Good elasticity---have a polishing effect, good surface quality of the workpiece.

Stable quality---uniform consumption in use and long service life.

 

 

Specification :

Universally specification

Bond

Type

Specification

Resin bond

 

1A1

14A1

200D-20T-20H-5W

250D-25T-76H-5W

300D-20T-127/203H-5W

300D-40T-127/203H -5W

350D-40T-127/203H -5W

400D-40T-127/203H -5W

Metal bond

 

 66D-8W-56L
Note: the wheel specification can be produced according to customer’s requirement.

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