Results forindium phosphide semiconductor substratesfrom 777 Products.
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Chip Molding Device 【Performance Parameters】 ● Model pressure: 98-1764kn; ● injection molding pressure: 4.9-29.4kn can be adjusted; ● Applicable lead frame/substrate size: 20-90mm ...
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2inch GaN substrates template,GaN wafer for LeD,semiconducting Gallium Nitride Wafer for ld,GaN template, mocvd GaN Wafer,Free-standing GaN Substrates by Customized size,small size ...
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Alumina ceramic basic chip thin-film circuit semiconductor-integrated circuit led lamp Alumina ceramic basic chip product name:Alumina ceramic basic chip product description: As a ...
china
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NCVM is short name of None Conductive Vacuum Metallizing, which is used for plastic parts plated which coated by vacuum deposition technology. This techniques uses each other ...
china
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20khz/600W ultrasonic tin plating machine dip soldering machine Do you know what is the ultrasonic tin plating? Ultrasonic tin plating is a method used for electroplating a layer ...
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10x15mm 100 Orientation Gallium oxide GaO substrate 100 orientation with Fe doped 10x15mm Gallium oxide GaO substrate 100 orientation 10x10mm Gallium oxide substrate monocline ...
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UV Resistant Tape UV tape is a special tape, which has excellent adhesiveness under normal conditions. But its adhesiveness decreases rapidly after exposure of UV light. UV tape ...
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350 ± 25 μm (11-20) ± 3o, 8 ± 1 mm 2-inch Free-standing U-GaN/SI-GaN Substrates 2inch C-face Un-doped n-type free-standing GaN single crystal substrate Resistivity < 0.1 Ω·cm Power ...
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With wide direct bandgap(3.4 eV), strong atomic bonds, high thermal conductivity and excellent radiation resistance, GaN is not only short-wave-length optoelectronic material, but ...
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Application:NAND memory package,Memory electronics,storage electronics,Flash memory,FBGA/PBGA package,Semiconductor package; Spec.of pcb production: Mini.Line space/width:1mil ...
china
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Automatic Encapsulation Equipment Features Product Name: Semiconductor Molding Machine Injection Unit: Single Type: Vertical Injection Molding Machine Platen Size: 600 X 600 Mm ...
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Customized size 2inch/3inch/4inch/6inch 6H-N/4H-SEMI/ 4H-N SIC ingots/High purity 4H-N 4inch 6inch dia 150mm silicon carbide single crystal (sic) substrates wafers/4 inch 4h-N type ...
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4'' 6'' AIN On Silicon Substrates SSP DSP Semiconductor Wafers 100nm 200nm Layer Description: Aluminum Nitride on Silicon Wafers is a new type of semiconductor material that offers ...
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Ceramic block is made of high purity and ultra-fine alumina powder by high temperature curing. Main features High purity, less impurities, high hardness,wear resistance and ...
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Application:Camera modules electronics,modules electronics,Consumer electronics,Sensors electronics,Semiconductor package; Spec.of pcb production: Mini.Line space/width:1mil (25um) ...
china
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Semicon Transfer Molding 【Performance parameters】 ● Model pressure: 98-1764kn; ● injection molding pressure: 4.9-29.4kn can be adjusted; ● Applicable lead frame/substrate size: 20...
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2inch 5um thickness AlN Aluminum Nitride Template on 430um sapphire/ 350um Sic substrates AlN Wafer Characteristic III-Nitride(GaN,AlN,InN) 2inch AlN template on sapphire or sic ...
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Chip Molding Equipment Features: ● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products; ● Full servo ...
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SiC Substrate/Wafers (150mm, 200mm) Silicon Carbide Ceramic Excellent CorrosionSingle crystal single side polished silicon wafer sic wafer polishing wafer manufacturer Silicon ...
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Auto Chip Transfer Molding Performance Parameters: ● Mold closing pressure: 98-1764kN; ● Injection pressure: 4.9-30kN adjustable; ● Applicable leadframe/substrate size: width 20...
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