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1oz 8 Layer Main Control Board FR4 PCB Surface Mount Technologies

Angel Technology Electronics Co

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Address: Fl12,Tower E XingHe World LongHua District Shenzhen China 518000

Contact name:Sophia

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1oz 8 Layer Main Control Board FR4 PCB Surface Mount Technologies

Country/Region china
City & Province shenzhen hongkong
Categories Advertising Screens
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Product Details

8-layers main control board FR4 PCB Printed Circuit Board SMT and pcb manufacturing service

 

Our circuits boards range from double layers to 24 layers.

The product types include ordinary boards, medium and high Tg boards, involving special processes such as semi-hole,

bonding, impedance, blue glue, carbon oil, gold fingers, blind gongs, buried blind holes , Countersunk holes, etc.;

surface treatment can be ordinary tin spray, lead-free tin spray, immersion gold, electro-nickel gold, electro-hard gold,

QSP, immersion silver, immersion tin or composite processes, etc..

 

Our PCB are widely used in smart electronics, communications Technology, power technology, industrial control,

security engineering, automotive industry, medical control and optoelectronic engineering and other fields.

 

8-layers main control board FR4 PCB Printed Circuit Board Specification:

Base materialFR4Layer(s)8
Permittivity4.3Thickness1.6mm
Outer copper thickness1Ozcopper thickness(Inner)1oZ
Mounting TypeImmersion goldMin Hole Diameter0.2mm
Minimum line width0.1mm(MLI)Min Line Space0.1mm
ApplicationElectrical box

Characteristic

 

TG170,

High Reliability,

8-layers boards

High TG material

 

8-layers main control board FR4 PCB Printed Circuit Board images:

 

 

Impedance PCB(Printed Circuit Board) for Electrical box shown details :

 

 

Our PCB factory is fully qualified and has passed a series of certifications including UL, ISO9001, ISO14001,

ISO/TS16949, CQC and so on.

 

Quote Requirement:

 

*Gerber file of the bare PCB board.

*BOM (Bill of material) for assembly.

*To short the lead time, please kindly advise us if there is any acceptable components substitution.

*Testing Guide & Test Fixtures if necessary.

 

 


PCB Assembly Capabilities
ItemTechnical Parameter
SMT Jointing Min. Space0201mm
QFP SpacePitch 0.3mm
Min. Package0201
Min. Size2*2 inch(50*50mm)
Max. Size14*22 inch(350*550mm)
Placement Precision±0.01mm
Placement PrecisionQFP, SOP, PLCC, BGA
Placement Capability0805, 0603, 0402, 0201

 

PCB Lead time (workday(s)) Normally
 Single, Double-sided4 layer6 layerOver 8 layerHDI
Sample Lead time (Normal)5-66-77-810-1210-12
Sample Lead time (Faster)48-72 hours566-712
Mass production lead time7-910-1213-151620
PCB Assembly Lead time
Sample Lead timePCB Fab+Components preparation +PCBA=15 workdays
Mass production lead timePCB Fab+Components preparation +PCBA=21workdays

 

 

 

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