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Polyurethane Heat Transfer Printing Tpu Hot Melt Adhesive Powder Resistance To Yellowing

East Sun New Material Technology (Shenzhen) Co., Ltd.

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Address: Tunsing Industrial Zone, No. 28 Xiatian village, Longtian street, Pingshan District, Shenzhen City, Guangdong Province, China.

Contact name:Abby

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Polyurethane Heat Transfer Printing Tpu Hot Melt Adhesive Powder Resistance To Yellowing

Country/Region china
City & Province shenzhen guangdong
Categories Adhesives & Sealants
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Product Details

Polyurethane Heat Transfer Printing Tpu Hot Melt Adhesive Powder Resistance To Yellowing

TPU Hot Melt Adhesive Powde Product model: ES250

Description:The product belongs to aliphatic polyurethane thermoplastic powder hot melt adhesive. It has excellent
color stability, no yellowing, soft feel, excellent processability, and excellent bonding properties for fabric, cotton, blended fabric.

Function:Heat transfer,Silk screen printing.

TPU Hot Melt Adhesive Powde Physical Characteristics:

 

PropertyCriterion
AppearanceWhite powder
CompositionTPU
Density ASTM D-7921.2±0.02 g/cm³
Melt Point DSC110-130 ℃
Melt Index ASTM D-123825±5g/10min
Hardness ASTM D-224088±2 Shore A
Resistance to yellowing (level)4.0-5.0
Powder size range0-80 um
80-200 um
150-250 um

 

Technical Parameters:

 

Bonding parameters (for reference only)Temperature120-140℃
Press0.5-1.5 kg/cm2
Time8-25S
Washing Resistance40℃Excellent
60℃Good
90℃/

 

Packaging and Storage Conditions:

Packaging20KG in one PE bag+Brown paper bag
Storage ConditionsStored in dry unopened packaging at room temperature for 12 months. High temperature and pressure will cause agglomeration. The trays cannot be double-pressed.


1. Bonding temperature and pressure and time relate to the bonding strength of the film to the material. The bonding temperature must be close to the temperature set by the machine, the pressure must be uniform, and the mold and press rolls must be flat.

2. The bonding conditions used will vary between machines and materials. The conditions indicated here are only basic. The most ideal bonding conditions should be established by manufacturing for the specific application.

 

 

 

 

 

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