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Featured Products: Microelectronics IC substrate manufacture, BT semiconductor IC packaging substrate manufacture, Flash/NAND memory package substrate production and more.

Microelectronics IC substrate manufacture

Application:Memory card/UDP,IC substrate.IC package,IC assembly,TF card,MrcroSD card;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate ...

[Last Updated : 2024-04-11]

Microelectronics IC substrate manufacture

BT semiconductor IC packaging substrate manufacture

Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC ...

[Last Updated : 2024-04-11]

BT semiconductor IC packaging substrate manufacture

Flash/NAND memory package substrate production

Application:Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS...

[Last Updated : 2024-04-11]

Flash/NAND memory package substrate production

Multilayer BT materials semiconductor package substrate manufacture

Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC ...

[Last Updated : 2024-04-11]

Multilayer BT materials semiconductor package substrate manufacture

CMOS sensors ic package manufacture supporting

Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,telecommunication electronics,consumer electronics,Storage IC substrage;IC package,Semiconductor ...

[Last Updated : 2024-04-11]

CMOS sensors ic package manufacture supporting

MiniLED substrate manufacture supporting

high precision LED packaging substrate for Mini LED/Micro LED Application:MiniLED/Mirco LED Line space/width:1mil (25um) Spec.of pcb production: FR4/BT (0.1-1.0mm) finished ...

[Last Updated : 2024-04-11]

MiniLED substrate manufacture supporting

MicroLED/MniLED package substrate manufacture

High Precision Fine Pitch LED package substrate with Plating Silver 0.4mm finished BT thickness,ROHS passed Application:Led lighting,LED display,LED displays,Outdoor LED pcb...

[Last Updated : 2024-04-11]

MicroLED/MniLED package substrate manufacture

LED chip ic package substrate manufacture supporting

Application:Semi Package,LED chip package,Semiconductors ,Semiconductor,IC package,miniLED,MicroLED,MEMS,IC assembly,Storage IC substrage; Spec.of substrate production: Mini.Line ...

[Last Updated : 2024-04-11]

LED chip ic package substrate manufacture supporting

MicroLED/MiniLED package substrate manufacture

Fine Pitch Micro Pcb Board with none misregistration SR Application:LED display,LED displays,Lighting pcb,outdoor Led; Spec.of pcb production: Mini.Line space/width:1mil (25um) ...

[Last Updated : 2024-04-11]

MicroLED/MiniLED package substrate manufacture

Horexs 0.2mm Thickness BGA package substrate full resin plug all holes and cap plating

Horexs 0.2mm Thickness full resin plug all holes and cap plating Application:MicroLED,MiniLED,LED display,LED displays; Spec.of substrate production: Mini.Line space/width:1mil ...

[Last Updated : 2024-04-11]

Horexs 0.2mm Thickness BGA package substrate full resin plug all holes and cap plating

0.28mm Finished Lead Free memory chip substrate manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.28mm; ...

[Last Updated : 2024-04-11]

0.28mm Finished Lead Free memory chip substrate manufacture

OEM ODM semiconductor packaging substrate China mainland

Application:LED keyboards electronics,consumer electronics,telecom.electronics;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: ...

[Last Updated : 2024-04-11]

OEM ODM semiconductor packaging substrate China mainland

0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; ...

[Last Updated : 2024-04-11]

0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate

RF/Wireless/5G IC module substrate manufacture

Application:IC package,Microelectronics devices,Microelectronics assembly,Microelectronics package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate ...

[Last Updated : 2024-04-11]

RF/Wireless/5G IC module substrate manufacture

microelectronics package substrate manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory,Microelectronics assembly,Microelectronics package; Spec.of substrate production: Mini.Line space...

[Last Updated : 2024-04-11]

microelectronics package substrate manufacture

FBGA Package substrate production supporting BT 40um core

Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,FC package substrate,FlipChip substrate,Flipchip BGA substrate;IC package,Semiconductor ...

[Last Updated : 2024-04-11]

FBGA Package substrate production supporting BT 40um core

semiconductor packaging Substrate of DRAM Memory manufacture

Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate ...

[Last Updated : 2024-04-11]

semiconductor packaging Substrate of DRAM Memory manufacture

ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication

Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory ...

[Last Updated : 2024-04-11]

ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication

BT FR4 4 Layer CSP Substrate ENEPIG Improved Tenting

Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconductor package; Spec.of substrate ...

[Last Updated : 2024-04-11]

BT FR4 4 Layer CSP Substrate ENEPIG Improved Tenting

2-6 Layer BT taw material BGA packaging Substrate For semiconductor assembly

Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package,Semiconductor package,Memory electronic...

[Last Updated : 2024-04-11]

2-6 Layer BT taw material BGA packaging Substrate For semiconductor assembly

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