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XCZU9EG-L2FFVB1156E Integrated Circuits ICs IC FPGA 328 I/O 1156FCBGA

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HENKOSINO TECHNOLOGY CO.,LTD

XCZU9EG-L2FFVB1156E Integrated Circuits ICs IC FPGA 328 I/O 1156FCBGA

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We can supply XCZU9EG-L2FFVB1156E , send us a request quote to request XCZU9EG-L2FFVB1156E pirce and lead time.https://www.henkochips.com a professional electronic components distributor. With 10+ Million line items of available electronic components can ship in short lead-time, over 250 thousand part numbers of electronic components in stock for immediately delivery, which may include part number XCZU9EG-L2FFVB1156E.The price and lead time for XCZU9EG-L2FFVB1156E depending on the quantity required, availability and warehouse location.Contact us today and our sales representative will provide you price and delivery on Part XCZU9EG-L2FFVB1156E.We look forward to working with you to establish long-term relations of cooperation

 

Detailed Description:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 256KB 533MHz, 600MHz, 1.3GHz 1156-FCBGA (35x35)
Flash Size:-
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Moisture Sensitivity Level (MSL):4 (72 Hours)
Manufacturer Standard Lead Time:10 Weeks
Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes:Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Series:Zynq® UltraScale+™ MPSoC EG
Architecture:MCU, FPGA
Operating Temperature:0°C ~ 100°C (TJ)
Peripherals:DMA, WDT

 

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