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Multilayer Holes Immersion HDI PCB Circuit Board Gold

Topmatch Electronics (Suzhou) Co., Limited.
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Topmatch Electronics (Suzhou) Co., Limited.

Multilayer Holes Immersion HDI PCB Circuit Board Gold

Country/Region china
City & Province suzhou jiangsu
Categories Digital Cameras
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Product Details

Multilayer Printed Circuit Board Holes Immersion Gold HDI PCB Circuit Board

 

As electronic products tend to be multifunctional and complex, the contact distance of integrated circuit components decreases and the speed of signal transmission increases.With the increase in the number of connections and the shortening of the local length of interpoint circuit. We need the application of high-density line configuration and microhole technology is required to achieve the goal. HDI PCB has many technical advantages.

 

  • Design flexibility. HDI boards offer designers more design flexibility. Designers can take advantage of high component density, which facilitates faster signal processing.
  • Save space. Due to its advanced technical features, HDI board can easily accommodate more connections on the same board with fewer layers.
  • Suitable for intensive and complex packages. HDI is a good choice for intensive and complex packages involving high pin count and low spacing.
  • HDI boards meet the growing demand for smaller PCBS. non-HDI boards require more space and weight, making them difficult to use in many cases. Similarly, multiple PCBS can be integrated into a single HDI.
  • Signal integrity. The advanced technical features of this kind of PCB can help improve signal integrity and electrical performance.

 

1 . Descriptions:

 

What is a HDI PCB?

 

HDI stands for High Density Interconnector. A circuit board which has a higher wiring density per unit area as opposed to conventional board is called as HDI PCB. HDI PCBs have finer spaces and lines, minor vias and capture pads and higher connection pad density. It is helpful in enhancing electrical performance and reduction in weight and size of the equipment. HDI PCB is the better option for high-layer count and costly laminated boards.


Regarding the electrical needs of high-speed signal, the board should have various features i.e. high-frequency transmission capability, impedance control, decreases redundant radiation, etc. The board should be enhanced in the density because of the miniaturization and arrays of the electronic parts. In addition, to the result of the assembling techniques of leadless, fine pitch package and direct chip bonding, the board is even featured with exceptional high-density.


Innumerable benefits are associated with HDI PCB, like high speed, small size and high frequency. It is the primary part of portable computers, personal computers, and mobile phones. Currently, HDI PCB is extensively used in other end user products i.e. as MP3 players and game consoles, etc.

 

2 . Specifications:

 

Name1.0mm flexible 12 Anylayer HDI / Optical module board
Number of Layers12
Quality GradeIPC 6012 Class 2,IPC 6012 Class 3
MaterialEM528K
Thickness1.0mm
Min Track/Spacing50um/60um
Min Hole SizeLaser 75um; Drilling size 200um
Solder MaskBlue
SilkscreenWhite
Surface FinishENEPIG
Finished Copper12um
Production time10-21 working days
Lead time2-3 days

 

 

3. Advantages:

 

The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.

Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.

 

 

 

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