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P Type , Gallium Arsenide Wafer With (100) Orientation , 4”, Test Grade

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XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.

P Type , Gallium Arsenide Wafer With (100) Orientation , 4”, Test Grade

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Product Details

P Type , Gallium Arsenide Wafer With (100) Orientation , 4”, Test Grade

 

PAM-XIAMEN Develops and manufactures compound semiconductor substrates-gallium arsenide crystal and wafer. We has used advanced crystal growth technology, vertical gradient freeze(VGF) and (GaAs)Gallium Arsenide wafer processing technology. The required electrical properties are obtained by adding dopants such as silicon or zinc. The result is n-type or p-type high-resistance (>10^7 ohm.cm) or low-resistance (<10 - 2 ohm.cm) semiconductors. The wafer surfaces are generally epi-ready (extremely low contamination) i.e. their quality is suitable for direct use in epitaxial processes.

 

(GaAs)Gallium Arsenide Wafers for LED Applications

ItemSpecifications 
Conduction TypeSC/p-type with Zn dope Available
Growth MethodVGF
DopantMg
Wafer Diamter4, inch
Crystal Orientation(100)2°/6°/15° off (110)
OFEJ or US
Carrier ConcentrationE19
Resistivity at RT
Mobility

1500~3000cm2/V.sec

 

Etch Pit Density<5000/cm2
Laser Marking

upon request

 

Surface Finish

P/E or P/P

 

Thickness

220~450um

 

Epitaxy ReadyYes
PackageSingle wafer container or cassette

 

Properties of GaAs Crystal

PropertiesGaAs
Atoms/cm34.42 x 1022
Atomic Weight144.63
Breakdown Fieldapprox. 4 x 105
Crystal StructureZincblende
Density (g/cm3)5.32
Dielectric Constant13.1
Effective Density of States in the Conduction Band, Nc (cm-3)4.7 x 1017
Effective Density of States in the Valence Band, Nv (cm-3)7.0 x 1018
Electron Affinity (V)4.07
Energy Gap at 300K (eV)1.424
Intrinsic Carrier Concentration (cm-3)1.79 x 106
Intrinsic Debye Length (microns)2250
Intrinsic Resistivity (ohm-cm)108
Lattice Constant (angstroms)5.6533
Linear Coefficient of Thermal Expansion,6.86 x 10-6
ΔL/L/ΔT (1/deg C)
Melting Point (deg C)1238
Minority Carrier Lifetime (s)approx. 10-8
Mobility (Drift)8500
(cm2/V-s)
µn, electrons
Mobility (Drift)400
(cm2/V-s)
µp, holes
Optical Phonon Energy (eV)0.035
Phonon Mean Free Path (angstroms)58
Specific Heat0.35
(J/g-deg C)
Thermal Conductivity at 300 K0.46
(W/cm-degC)
Thermal Diffusivity (cm2/sec)0.24
Vapor Pressure (Pa)100 at 1050 deg C;
1 at 900 deg C

 

 
WavelengthIndex
(µm)
2.63.3239
2.83.3204
33.3169
3.23.3149
3.43.3129
3.63.3109
3.83.3089
43.3069
4.23.3057
4.43.3045
4.63.3034
4.83.3022
53.301
5.23.3001
5.43.2991
5.63.2982
5.83.2972
63.2963
6.23.2955
6.43.2947
6.63.2939
6.83.2931
73.2923
7.23.2914
7.43.2905
7.63.2896
7.83.2887
83.2878
8.23.2868
8.43.2859
8.63.2849
8.83.284
93.283
9.23.2818
9.43.2806
9.63.2794
9.83.2782
103.277
10.23.2761
10.43.2752
10.63.2743
10.83.2734
113.2725
11.23.2713
11.43.2701
11.63.269
11.83.2678
123.2666
12.23.2651
12.43.2635
12.63.262
12.83.2604
133.2589
13.23.2573
13.43.2557
13.63.2541

 

What is GaAs wafer?

Gallium arsenide (GaAs) is a compound of the elements gallium and arsenic. It is a III-V direct band gap semiconductor with a zinc blende crystal structure.

GaAs wafer is an important semiconducor material. It belongs to group III-V compound semiconductor. It is a sphalerite type lattice structure with a lattice constant of 5.65x 10-10m, a melting point of 1237 ℃ and a band gap of 1.4 EV. Gallium arsenide can be made into semi insulating high resistance materials with resistivity higher than silicon and germanium by more than three orders of magnitude, which can be used to make integrated circuit substrate, infrared detector, γ photon detector, etc. Because its electron mobility is 5-6 times larger than that of silicon, it has been widely used in microwave devices and high-speed digital circuits. The semiconductor device made of GaAs has the advantages of high frequency, high temperature and low temperature, low noise and strong radiation resistance. In addition, it can also be used to make bulk effect devices.

 

What is the Mechanical properties, elastic constants, lattice vibrations of GaAs Wafer?

Basic Parameter

Bulk modulus7.53·1011 dyn cm-2
Density5.317 g cm-3
Hardness on the Mohs scalebetween 4 and 5
Surface microhardness (using Knoop's pyramid test)750 kg mm-2
Cleavage plane{110}
Piezoelectric constante14=-0.16 C m-2

Elastic constants 300 K.

C11=11.90·1011 dyn/cm2
C12=5.34·1011 dyn/cm2
C44=5.96·1011 dyn/cm2

Temperature dependences of elastic constants.
For 0<T<Tm=1513K (in units of 1011 dyn cm-2)
C11= 12.17 - 1.44·10-3T
C12= 5.46 - 0.64·10-3T
C44= 6.16 - 0.70·10-3T
 

For T = 300 K

Bulk modulus (compressibility-1)Bs= 7.53·1011dyn/cm2
Shear modulusC'= 3.285·1011dyn/cm2
[100] Young's modulusYo= 8.59·1011dyn/cm2
[100] Poisson ratioσo = 0.31

Acoustic Wave Speeds

Wave
propagation
Direction
Wave
character
Expression for wave speedWave speed
(in units of
105 cm/s)
[100]VL(C11/ρ )1/24.73
VT(C44/ρ )1/23.35
[110]Vl[(C11+Cl2+2C44)/2ρ ]1/25.24
Vt||Vt||=VT=(C44/ρ)1/23.35
Vt⊥[(C11-C12)/2ρ]1/22.48
[111]Vl'[(C11+2C12+4C44)/3ρ]1/25.4
Vt'[(C11-C12+C44)/3ρ]1/22.8

Phonon frequencies

(in units of 1012 Hz)

νTO(Γ)8.02νLO (X)7.22
νLO(Γ)8.55νTA(L)1.86
νTA(X)2.36νLA(L)6.26
νLA(X)6.80νTO(L)7.84
νTO(X)7.56νLO(L)7.15

 

Are You Looking for GaAs substrate?

PAM-XIAMEN is proud to offer indium phosphide substrate for all different kinds of projects. If you are looking for GaAs wafers, send us enquiry today to learn more about how we can work with you to get you the GaAs wafers you need for your next project. Our group team is looking forward to providing both quality products and excellent service for you!

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