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N Type , Si-Doped Single Crystal Gallium Arsenide Wafer , 4”, Test Grade

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XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.

N Type , Si-Doped Single Crystal Gallium Arsenide Wafer , 4”, Test Grade

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Product Details

N Type , Si-Doped Single Crystal Gallium Arsenide Wafer , 4”, Test Grade

 

PAM-XIAMEN provides both single crystal and polycrystalline GaAs wafer ( Gallium Arsenide ) for opto-electronics and micro-electronics industry for making LD , LED , microwave circuit and solar cell applications , the wafers is in diameter range from 2" to 6" in various thicknesses and orientations. We offer single crystal GaAs wafer produced by two main growth techniques LEC and VGF method , allowing us to provide customers the widest choice of GaAs material with high uniformity of electrical properties and excellent surface quality . Gallium Arsenide can be supplied as ingots and polished wafer, both conducting and semi-insulating GaAs wafer , mechanical grade and epi ready grade are all available . We can offer GaAs wafer with low EPD value and high surface quality suitable for your MOCVD and MBE applications. PAM-XIAMEN can produce wide range grades: prime grade, test grade, and optical grade. Please contact our engineer team for more wafer information.

(GaAs)Gallium Arsenide Wafers for LED Applications

ItemSpecifications 
Conduction TypeSC/n-type
Growth MethodVGF
DopantSilicon
Wafer Diamter4, inch
Crystal Orientation(100)2°/6°/15° off (110)
OFEJ or US
Carrier Concentration

(0.4~2.5)E18/cm3

 

Resistivity at RT(1.5~9)E-3 Ohm.cm
Mobility

1500~3000cm2/V.sec

 

Etch Pit Density<5000/cm2
Laser Marking

upon request

 

Surface Finish

P/E or P/P

 

Thickness

220~450um

 

Epitaxy ReadyYes
PackageSingle wafer container or cassette

 

(GaAs)Gallium Arsenide Wafers for LD Applications

ItemSpecificationsRemarks
Conduction TypeSC/n-type 
Growth MethodVGF 
DopantSilicon 
Wafer Diamter4, inchIngot or as-cut available
Crystal Orientation(100)2°/6°/15°off (110)Other misorientation available
OFEJ or US 
Carrier Concentration(0.4~2.5)E18/cm3 
Resistivity at RT(1.5~9)E-3 Ohm.cm 
Mobility1500~3000 cm2/V.sec 
Etch Pit Density<500/cm2 
Laser Markingupon request 
Surface FinishP/E or P/P 
Thickness220~350um 
Epitaxy ReadyYes 
PackageSingle wafer container or cassette

Properties of GaAs Crystal

PropertiesGaAs
Atoms/cm34.42 x 1022
Atomic Weight144.63
Breakdown Fieldapprox. 4 x 105
Crystal StructureZincblende
Density (g/cm3)5.32
Dielectric Constant13.1
Effective Density of States in the Conduction Band, Nc (cm-3)4.7 x 1017
Effective Density of States in the Valence Band, Nv (cm-3)7.0 x 1018
Electron Affinity (V)4.07
Energy Gap at 300K (eV)1.424
Intrinsic Carrier Concentration (cm-3)1.79 x 106
Intrinsic Debye Length (microns)2250
Intrinsic Resistivity (ohm-cm)108
Lattice Constant (angstroms)5.6533
Linear Coefficient of Thermal Expansion,6.86 x 10-6
ΔL/L/ΔT (1/deg C)
Melting Point (deg C)1238
Minority Carrier Lifetime (s)approx. 10-8
Mobility (Drift)8500
(cm2/V-s)
µn, electrons
Mobility (Drift)400
(cm2/V-s)
µp, holes
Optical Phonon Energy (eV)0.035
Phonon Mean Free Path (angstroms)58
Specific Heat0.35
(J/g-deg C)
Thermal Conductivity at 300 K0.46
(W/cm-degC)
Thermal Diffusivity (cm2/sec)0.24
Vapor Pressure (Pa)100 at 1050 deg C;
1 at 900 deg C

 

 
WavelengthIndex
(µm)
2.63.3239
2.83.3204
33.3169
3.23.3149
3.43.3129
3.63.3109
3.83.3089
43.3069
4.23.3057
4.43.3045
4.63.3034
4.83.3022
53.301
5.23.3001
5.43.2991
5.63.2982
5.83.2972
63.2963
6.23.2955
6.43.2947
6.63.2939
6.83.2931
73.2923
7.23.2914
7.43.2905
7.63.2896
7.83.2887
83.2878
8.23.2868
8.43.2859
8.63.2849
8.83.284
93.283
9.23.2818
9.43.2806
9.63.2794
9.83.2782
103.277
10.23.2761
10.43.2752
10.63.2743
10.83.2734
113.2725
11.23.2713
11.43.2701
11.63.269
11.83.2678
123.2666
12.23.2651
12.43.2635
12.63.262
12.83.2604
133.2589
13.23.2573
13.43.2557
13.63.2541

 

What is the GaAs Process?

GaAs wafers must be prepared prior to device fabrication. To start, they must be completely cleaned to remove any damage that might have occurred during the slicing process. The wafers are then Chemically Mechanically Polished/Plaranrized (CMP) for the final material removal stage. This allows for the attainment of super-flat mirror-like surfaces with a remaining roughness on an atomic scale. After that is completed, the wafer is ready for fabrication.

 

What is the Basic Parameters at 300 K of GaAs Wafer?

Crystal structureZinc Blende
Group of symmetryTd2-F43m
Number of atoms in 1 cm34.42·1022
de Broglie electron wavelength240 A
Debye temperature360 K
Density5.32 g cm-3
Dielectric constant (static )12.9
Dielectric constant (high frequency)10.89
Effective electron mass me0.063mo
Effective hole masses mh0.51mo
Effective hole masses mlp0.082mo
Electron affinity4.07 eV
Lattice constant5.65325 A
Optical phonon energy0.035 eV

 

Are You Looking for GaAs substrate?

PAM-XIAMEN is proud to offer indium phosphide substrate for all different kinds of projects. If you are looking for GaAs wafers, send us enquiry today to learn more about how we can work with you to get you the GaAs wafers you need for your next project. Our group team is looking forward to providing both quality products and excellent service for you!

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