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Optical Glass Sapphire Substrate 2 Inch 0.1mm 0.175mm Thickness Wafers For DSP

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Optical Glass Sapphire Substrate 2 Inch 0.1mm 0.175mm Thickness Wafers For DSP

Country/Region	china
City & Province	shanghai shanghai

Product Details

ultrathin sapphire glass wafer ,2inch C-axis sapphire wafer for epi-ready,sapphire thick glass lens for covering,sapphire optical windows,2inch 0.1mm thickness sapphire wafer,

Chemically, sapphire is single crystal aluminum oxide (Al2O3), and is useful in a transmission range from 0.2 - 5.5µm.Sapphire , so making them ideal materials for demanding applications (such as laser systems) because of their extreme surface hardness, high thermal conductivity, high dielectric constant and resistance to common chemical acids and alkalis. And sapphire also is the second hardest crystal next to diamonds and, because of their structural strength, sapphire windows can be made much thinner than other common dielectric windows with improved transmittance.
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We can supply professional customized service in time and provide cooperation and support of new product development and technology appliance.

Material Sapphire(Al2O3)
Density(20°C) Kg/m3   3.98×103
Crystal Structure   hexagonal
Crystal lattice constant a=4.785Å c=12.991 Å
Mohs hardness 9
Melting Point   2045°C
Boiling Point 3000°C
Coefficient of Thermal Expansion α=5.8×10 -6 /K
Specific heat 0.418W.s/g/k
Thermal conductio 25.12W/m/k(@100°C)
Refractive Index (nd)   no=1.768ne=1.76
dn/dt   13×10-6/K(@633nm)
Tranmission T≈85%(0.3~5um)
Permittivity   11.5(//c), 9.3(⊥c)

Applications
Sapphire Washers, Sapphire Windows, Sapphire Bearings, Sapphire Rods, Sapphire Tubes, Ruby
sapphire wafer, dome sapphire, Sapphire insulation Film, Sapphire ball lens, Sapphire/ruby ball

2inch 0.1mm thickness sapphire wafer specification

Material: Single crystal Al2O3 99.999％

Orientation: C-plane(0001) Off M -axis 0.2°±0.1

Diameter:50.80±0.2mm
Thickness :100±15um (80um also is ok) or 175±15um,
Primary flat:16±1mm (or round wafer)

OF Orientation flat: A axis±0.1°
Frontside Surface Roughness:Ra＜0.3nm
Backside Surface Roughness: 0.8~1.2um
( Or double side polished, both side Ra＜0.2nm)
TTV:＜10um BOW:-15~0um WARP:＜15um
Laser Mark Series No. by needs
Package:Vacuum-sealed containers with nitrogen backfill in a class 100 environment

Cleanliness :Free visible contamination

Sapphire Wafer Process Step

Sample