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[China]
Address: Room 1204, DingCheng International Building, 518028 Futian District, SHENZHEN, CN
Contact name:Doris Guo
ChongMing Group (HK) Int'l Co., Ltd |
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TS3USB30ERSWR Ethernet Switch IC USB Switch ICs High-Spd USB 2.0 1:2 Mux/Demux Sw
1 Features
D+/D– Pins Tolerate up to 5.25 V
1.8-V Compatible Control-Pin Inputs
IOFF Supports Partial Power-Down-Mode Operation
RON = 10 Ω Maximum
ΔRON = 0.35 Ω Typical
Cio(ON) = 7.5 pF Typical
Low Power Consumption (1 μA Maximum)
–3-dB Bandwidth = 900 MHz Typical
Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II (1)
ESD Performance Tested Per JESD 22
– 8000-V Human-Body Model (A114-B, Class II)
– 1000-V Charged-Device Model (C101)
ESD Performance I/O Port to GND (2)
– 15000-V Human-Body Model
• Packaged in 10-pin UQFN (1.4 mm × 1.8 mm)
2 Applications
3 Description
The TS3USB30E is a high-bandwidth 1:2 switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (900 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs, or from two different hosts to one corresponding output. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).
The TS3USB30E integrates ESD protection cells on all pins, is available in a tiny UQFN package (1.8 mm × 1.4 mm) or a VSSOP package, and is characterized over the free-air temperature range of –40°C to 85°C.
Device Information
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
TS3USB30E | VSSOP (10) | 3.00 mm × 3.00 mm |
UQFN (10) | 1.80 mm × 1.40 mm |
