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Round FR4 Material Lead Free Soldering BGA Assembly

Shenzhen Shinelink Technology Ltd
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Address: Chengda Business Center, Rongfu Road, Fucheng Street, Longhua District, Shenzhen

Contact name:Lynn

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Shenzhen Shinelink Technology Ltd

Round FR4 Material Lead Free Soldering BGA Assembly

Country/Region china
City & Province shenzhen guangdong
Categories Other Welding & Soldering Supplies
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Product Details

FR4 Material BGA Assembly Lead Free Soldering Electronic Circuit Board Green

 

 

SHINELINK expert team can help with your printed circuit board assembly needs. From PCB fabrication to components purchasing to assembly, we are all in, providing you with a full line PCB assembly and testing services.

 

Before assembling, we will take time to make sure the PCBs and all of the components are in a good condition according to the functionality. Everything is ok, then the whole production will go smooth and fast, this will save much time,cause we know it’s crucial to you.

 

 

Files Requested For PCB Assembly Quotation

---In order to provide you with the most efficient and accurate quote on manufacturing the requested unit, we ask that you provide us with the following information.
1. Gerber file,PCB file,Eagle file or CAD file are all acceptable
2. A detailed bill of materials (BOM)
3. Clear pictures of PCB or PCBA sample for us
4. Quantity and delivery required
5. Test method for PCBA to guarantee 100% good quality products.
6. Schematics file for PCB design if need to do function test.
7. A sample if available for better sourcing
8. CAD files for enclosure manufacturing if required
9. A complete wiring and assembly drawing showing any special assembly instructions if required

 
 
Shinelink kinds PCBA product
 
Rigid 1oz Copper PCBA Board Assembly PCB 2 Layer ODM PCBA Immersion Gold
 
94V0 PCBA manufacture Scale capabilities up to
We combine advanced processes with highly skilled resources. Keeping up with the leading advanced technology and management system in One-stop services of PCB assembly
 
SMT process (RoHs Compliant) Capabilities up to:
1. 0201 Chip Size
2. 12 mils Integrated Circuit (IC) Pitch
3. Micro Ball Grid Array (BGA) – Pitch 16 mils
4. Flip Chip (Controlled Collapse Chip Connection) – Pitch 5 mils
5. Quad Flat Package (QFP) – Pitch 12 mils

 


THT(Wave soldering) process (RoHs Compliant) Capabilities up to:

1.Single side wave soldering
2.SMT & THT mixture process

Rigid 1oz Copper PCBA Board Assembly PCB 2 Layer ODM PCBA Immersion Gold
 
 

PCB Assembly Capabilities

 

Turnkey PCBAPCB+components sourcing+assembly+package
Assembly detailsSMT and Thru-hole, ISO lines
Lead TimePrototype: 15 work days. Mass order: 20~25 work days
Testing on productsFlying Probe Test, X-ray Inspection, AOI Test, functional test
QuantityMin quantity: 1pcs. Prototype, small order, mass order, all OK
Files we needPCB: Gerber files(CAM, PCB, PCBDOC)
Components: Bill of Materials(BOM list)
Assembly: Pick-N-Place file
PCB panel SizeMin size: 0.25*0.25 inches(6*6mm)
Max size: 20*20 inches(500*500mm)
PCB Solder TypeWater Soluble Solder Paste, RoHS lead free
Components detailsPassive Down to 0201 size
BGA and VFBGA
Leadless Chip Carriers/CSP
Double-sided SMT Assembly
Fine Pitch to 0.8mils
BGA Repair and Reball
Part Removal and Replacement
Component packageCut Tape,Tube,Reels,Loose Parts
PCB assembly
process
Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing


 

PCBA Picture



 
FAQ:
 
1. What factors should be considered when choosing the material for a PCB board?
Below factors should be considered when we choose the material for PCB:
The material’s Tg value should be greater than the operation temperature;
Low CTE material has good performance of thermal stability;
Good thermal resistance performance: Normally PCBs are required to resist 250℃ for at least 50s.
Good flatness; In consideration of the electrical properties, low loss/high permittivity material is used on high frequency PCB; Polyimide glass fiber substrate used for flexible PCB; Metal core is used when the product has strict requirement of heat dissipation.

 
2. What’s the merits of O-leading's rIgid-flex PCB?
SHINELINK’s rigid-flex PCB has the characters of both FPC and PCB, so it can be used in some special products. Some part is flexible while the other part rigid, it can help save product’s interior space, reduce product volume and improve performance.
 
3. How to you make the impedance calculation?
The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment from POLAR INSTRUMENTS.
The equipment measures the impedance on a representative track configuration coupon of which the client has given us a determinate value and tolerance.

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