20v 300a Single Plating Rectifier For Copper Electroplating With 220v 3 Phase Input

20v 300a single Pulse rectifier for copper electroplating with 220v 3 phase input

Pulse rectifier electroplating is a powerful tool to control the electrodeposition of metal outer box. It uses time function to improve the physical and chemical properties of the coating by changing the pulse parameters, so as to save precious metals and obtain functional coating. Pulse rectifier electroplating belongs to modulation current electroplating, whose current is fluctuating or on / off DC impact current, so it is essentially on-off DC electroplating. There are many kinds of pulse current waveforms, usually square wave, triangle wave, zigzag wave, step wave and so on. However, in applications, the typical pulse power generation square wave pulse current is widely used.

Modulated current plating:

Traditional electroplating generally uses the form of direct current, called direct current. DC current is continuous and stable in the direction of the current, and does not change with time. DC current waveforms generally include single-phase half-wave, single-phase full-wave, three-phase half-wave, three-phase full-wave, DC or steady-state current, etc. . Power sources that generate these waveforms at the same time include: thyristor rectifier power supply and high-frequency switching power supply. The DC current has the characteristics of continuity or continuity, and it continuously controls the plating layer outside the plating solution. For example, DC current increases the cathode current density, suppresses side reactions, reduces the content of impurities in the coating, and improves the current distribution.

The direct current after the pulse signal or other modulated alternating signal is called the modulation current, and the plating process under the condition of the modulation current is called the modulation current plating. Modulation current electroplating mainly produces and exists to play a certain role in controlling the plating quality of the plating solution. You can get effects that DC plating cannot achieve. For example, pulse plating has a cathode density that is several times or even ten times higher than that of DC plating, resulting in a more detailed crystalline coating. Modulated current usually has several forms of direct plating, such as pulse plating, asymmetric exchange plating, and DC plating cycle.

The pulse plating current is actually used by the DC switch, but when the peak current of the DC switch is equivalent to times or even dozens of times of the ordinary DC current. It is this high instantaneous current density that reduces metal ions at very high overpotentials, making the crystal grains a fine deposit. Pulse rectification plating is widely used in electronic circuits, connectors, printed circuits, electroplating integrated frames, valve stems, etc. in the electronics industry. These products can greatly improve the performance of electronic devices and significantly save precious metals. Pulse rectification electroplating is one of the most widely used and current gain modulation current electroplating.

Application
Different volt and current has different applications

 
Specification