Active Member
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[China]
Address: 176#, The 7th Street, Economic & Technological Development Area. 450016, Zhengzhou, China
Contact name:
Zhengzhou Hongtuo Superabrasive Products Co., Ltd. |
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Electroplated bond HUb blades for silicon wafer,wafer compounds,ceramic
HT series of dicing blades cutting blade is high performance and high quality priduction with new electroforming technology made,can be widely applied in semiconductor wafer,semiconductor resistor,cerami,plastic sealing material.
Free samples available
Features
1.ultra thin design,can be used to deepen cutting and slotting precessing.
blade thickness range of 0.015mm -0.3mm.
Applications
silicon wafer,wafer compounds,ceramic ,sealed plastic materials,
Related Technical Parameters
| O.D | Thickness | I.D | ||||
| Size | Tolerance | Size | Standard tolerance | High precision tolerance | Size | Tolerance |
| 50~ 100 | +0.02 | 0.1~≤ 0.15 | ±0.005 | 25.4 30 31.75 40 60 80 88.9 | +0.02~ 0 | |
| 0.15~≤ 0.25 | ±0.005 | ±0.003 | ||||
| >0.25 | ±0.01 | ±0.005 | ||||
more pictures for you review
