Resin Bond Daimond Dicing Blade , Wafer Semicoductor Disco Dicing Blades

Resin bond daimond dicing Blade for wafer semicoductor,ceramic chips

Hongtuo’s HT-RB series resin bond diamond blades are some of the most advanced in diamond grinding technology. They apply a thermosetting resin bond material and inter it with diamond abrasives. This diamond grinding tool features an outstanding flexibility and can greatly improve cutting efficiency.It has become a preferred super abrasive tool for cutting hard, brittle and delicate materials, such as glass and crystalline materials.

Features:

1. Theresin bond diamond dicing blade comes with a great self-sharpening performance, which ensures a consistent sharpness and a high cutting efficiency.

2. Resin bonds are extremely flexible, therefore improving the surface finish quality.

Applications:

This dicing blade is best suited for cutting hard and brittle materials such as quartz and glass.

Specifications

Technical Parameters