Results forcompressible thermal conductive gap padfrom 36 Products.
|
|
3.0 W/mK ,2.0mmT Soft and compressible thermal conductive gap pad for IT infrastructure The TIF180-30-11US is a highly compliant Gap Pad material that is ideal for fragile ...
|
|
|
|
|
High Temperature Resistance Conductive Thermally Silicone Gel Pad Die Cutting LED Thermal Pad LED thermal pad is a high performance thermal conductive gap filling material, mainly ...
|
|
|
|
|
Soft and compressible for low stress applications 1.5mmT silicone sheets for Mass storage devices The TIF160-40-11US is a silicone based, thermally conductive gap pad. Its ...
|
|
|
|
|
compressible 1.5w/m.k thermal conductive silicone pad 2.5mmT TIF1100-02F for cooling components to the chassis of frame Ziitek company is a manufacturer of thermal conductive gap ...
|
|
|
|
|
1.5w/m.k gray compressible Thermally Conductivefoam pad 1mmT TIF140-02F for cooling components to the chassis of frame Ziitek company is a manufacturer of thermal conductive gap ...
|
|
|
|
|
1.25w/m.k Thermal Conductivity Gap Filler Thermal Insulation pad The TIF280 thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low ...
|
|
|
|
|
High Thermal Conductivity Thermal Conductive Silicon Pad For Heat Dissipation Thermal pad is also known as thermal conductive silicone gap filler, thermal gasket, soft thermal pad ...
|
|
|
|
|
OEM/ODM Laptop Gpu Cpu Silica Gel Thermally Conductive Pad Thermal interface silicone material is high-performance, thermal conductive gap filling materials. Mainly for the ...
|
|
|
|
|
3.0mmT Soft and Compressible for Low Stress Applications Conductive Pads for CD-Rom The TIF1120-20-10UF is a silicone based, thermally conductive gap pad. Its unreinforced ...
|
|
|
|
|
Thermal Gap Filler Replace Gap pad VO Ultra Soft for Cooling Components / LED TV Yellow Soft Compressible Ziitek provide thermal conductive gap fillers, low melting point thermal ...
|
|
|
|
|
Soft and Compressible Thermal Pad for AD-DC Power Adapters, 4.7 MHz The TIF1180N-40-10F is a silicone based, thermally conductive gap pad. Its unreinforced construction allows ...
|
|
|
|
|
1.5 W/m-K Soft and compressible for low stress applications silicone pads for mother board The TIF120-01US is a silicone based, thermally conductive gap pad. Its unreinforced ...
|
|
|
|
|
2.0 W/mK Soft and Compressible for Low Stress Applications Silicone Pads for LED Controller The TIF120-20-10UF is a silicone based, thermally conductive gap pad. Its unreinforced ...
|
|
|
|
|
4.0 W/mK Soft and Compressible for Low Stress Applications Tthermal Pad for Mainboard The TIF120N-40-10F is a silicone based, thermally conductive gap pad. Its unreinforced ...
|
|
|
|
|
ultra soft Soft and compressible for low stress applications for thermal conductive gap filler,5.0mmT,20±5 shore00 The TIF1200-12-05US use a special process, with silicone as the ...
|
|
|
|
|
ATE Heatsink Silicone Soft Compressible Materials with High Thermal Conductivity Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to ...
|
|
|
|
|
5.0mmT silicone pads Soft and compressible for Micro heat pipe thermal solutions The TIF1200-40-11US use a special process, with silicone as the base material, adding thermal ...
|
|
|
|
|
1.0mmT Soft and compressible for Low Stress Applications Silicone Pads for Memory Modules The TIF140-30-02US use a special process, with silicone as the base material, adding ...
|
|
|
|
|
Compressible CPU Thermal Pad for High Speed Mass Storage Drives Blue 5.5 MHz Dielectric Constant The TIF™500S Series thermally conductive interface materials are applied to fill ...
|
|
|
|
|
New thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK TIF035-05 is a soft silicone putty thermal gap filler,which blend with ...
|
|
|
You may also be interested in :
