1. Scope This specification covers the requirements for product performance
of 2.00mm pitch wire to board connectors series. 2. Construction,Dimensions,Material & Plating See the attached drawings 3. Ratings & Applicable Wires | Item | Standard | | Rated Voltage (Max.) | 100V AC/DC | Insulation O.D. 1.50mm (Max.) | | Rated Current (Max.) And Applicable Wires | AWG#24 | 2.0A AC/DC | | AWG#26 | 1.5A AC/DC | | AWG#28 | 1.0A AC/DC | | AWG#30 | 0.5A AC/DC | | Ambient Temperature Range | -25℃ ~ +85℃* |
*: Including terminal temperature rise 4. Electrical Performance | Test Description | Procedure | Requirement | | 4-1 | Contact Resistance | Mate connectors, measure by dry circuit, 20mV max., 10mA.(Based
upon JIS C5402 5.4) | 10mΩ (Max.) | | 4-2 | Insulation Resistance | Mate connectors, apply 500V DC between adjacent terminal or ground.
(Based upon JIS C5402 5.2/MIL-STD-202 Method 302 Cond. B) | 1000MΩ (Min.) | | 4-3 | Dielectric Withstanding Voltage | Mate connectors, apply 800V AC (rms) for 1 minute between adjacent
terminal or ground. (Based upon JIS C5402 5.1/MIL-STD-202 Method
301) | No Breakdown. | | 4-4 | Contact Resistance on Crimped Portion | Crimp the applicable wire on to the terminal, measure by dry
circuit, 20mV (Max.)., 10mA. | 5mΩ (Max.) |
5. Mechanical Performance | Test Description | Procedure | Requirement | | 5-1 | Actuator Insertion & Withdrawal Force | Insert and withdraw connectors at the speed rate of 25±3mm /
minute. | Refer to paragraph 7-2 | | 5-2 | Crimping Pull Out Force | Fix the crimped terminal, apply axial pull out force on the wire at
the speed rat of 25±3mm / minute.(Based upon JIS C5402 6.8) | AWG#24 | 3.0kgf (Min) | | AWG#26 | 2.0kgf (Min) | | AWG#28 | 1.0kgf (Min) | | AWG#30 | 0.8kgf (Min) | | 5-3 | Terminal Insertion Force. | Insert the crimped terminal into the housing. | 1.00kgf (Max.) | | 5-4 | Terminal/Housing Retention Force. | Apply axial pull out force at the speed rate of 25±3mm / minute on
the terminal assembled in the housing. | 1.50kgf (Min.) | | 5-5 | Pin Retention Force | Apply axial push force at the speed rate of 25±3mm / minute | 1.00kgf (Min.) | | 5-6 | Latch Yield Strength | Mate connectors and pull apart until both latches break at the
speed rate of 25±3mm / minute | 3.00kgf (Min.) | | 5-7 | Durability | When mated up to 50 cycles repeatedly by the rate of 10 cycle per
minute. | Contact Resistance 20mΩ (Max.) | | 5-8 | Vibration | Amplitude: 1.5mm P-P Sweep time: 10-55-10 Hz in 1 minute Duration: 2 hours in each
X.Y.Z. axes. (Based upon MIL-STD-202 Method 201A) | Appearance No Damage. Contact Resistance 20mΩ (Max.) Discontinuity 1 μsec.(Max.) | | 5-9 | Physical Shock | 490m/s²｛50G｝,3 strokes in each X.Y.Z. axes. (Based upon JIS
C0041/MIL-STD-202 Method 213B Cond. A) |
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6. Environmental Performance And Others | Test Description | Procedure | Requirement | | 6-1 | Temperature Rise | Carrying rated current load.(Based upon UL 498) | 30℃(Max.) | | 6-2 | Heat Resistance | 85±2℃,96 hours (Based upon JIS C0021/MIL-STD-202 Method 108A Cond.
A) | Appearance No Damage. Contact Resistance 20mΩ (Max.) | | 6-3 | Cold Resistance | -25±3℃,96 hours (Based upon JIS C0020) | | 6-4 | Humidity | Temperature: 40±2℃ Relative Humidity : 90~95% Duration: 96 hours (Based upon JIS C0022/MIL-STD-202 Method 103B Cond. B) | Appearance No Damage. Contact Resistance 20mΩ (Max.) Insulation Resistance 100MΩ (Min.) Dielectric Withstanding Voltage Must meet 4-3 | | 6-5 | Temperature Cycling | 5 cycles of: a) -55℃ 30 minutes b) +85℃ 30 minutes (Based upon JIS C0025) | Appearance No Damage. Contact Resistance 20mΩ (Max.) | | 6-6 | Salt Spray | Tin-plated 12 hours / Gold- plated 24 hours exposure to a salt
spray from the 5±1% solution at 35±2℃. (Based upon JIS
C0023/MIL-STD-202 Method 101D Cond. B) | | 6-7 | SO2 Gas | 24 hours exposure to 50±5ppm. SO2 gas at 40±2℃. | | 6-8 | NH3 Gas | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia
solution. | | 6-9 | Solderability | Soldering Time: 5±0.5 sec. Solder Temperature: 245±5℃ | Solder Wetting 95% of immersed area must show no voids, pin holes |
| 6-10 | Resistance to Soldering Heat (DIP) | Solder pot method Soldering time: 10±0.5 sec. Solder Temperature: 260±5℃ Solder iron method Soldering Time: 5±0.5 sec. Solder Temperature: 370℃ ~ 400℃ | Appearance No Damage. | | 6-11 | Resistance to Soldering Heat (SMT) | When reflowing Refer to paragraph 8 Solder iron method Soldering Time: 5±0.5 sec. Solder Temperature: 370℃ ~ 400℃ | Appearance No Damage. |
7. Crimp Specifications & Actuator Insertion/Withdrawal Force 7-1 Terminals with height, suggestion pressure width and wire and
terminal's retention | Wire Diameter | Numbers | Conductor Parts(Core Wire)mm | Insulation Parts(PVC)mm | | Width | Height | Width | Height | | AWG#24 | A2001 | 1.20±0.10 | 0.75±0.05 | 1.60(Max.) | 2.00(Max.)REF. | | AWG#26 | 0.70±0.05 | | AWG#28 | 0.65±0.05 | | AWG#30 | 0.60±0.05 |
7-2 WITHOUT A LOCK [Unit : kgf] | Circuits | At Initial | Circuits | At Initial | | Insertion (Max.) | Withdrawal (Min.) | Insertion (Max.) | Withdrawal (Min.) | | Single | 0.70 | 0.10 | 10 | 5.00 | 1.70 | | 02 | 1.00 | 0.50 | 11 | 5.50 | 1.70 | | 03 | 1.50 | 0.65 | 12 | 6.00 | 1.85 | | 04 | 2.00 | 0.80 | 13 | 6.00 | 2.00 | | 05 | 2.50 | 0.95 | 14 | 6.00 | 2.00 | | 06 | 3.00 | 1.10 | 15 | 6.00 | 2.00 | | 07 | 3.50 | 1.25 | 16 | 6.00 | 2.15 | | 08 | 4.00 | 1.40 | 17 | 6.00 | 2.15 | | 09 | 4.50 | 1.55 | 18 | 6.00 | 2.15 |
7-3 LOCK [Unit : kgf] | Circuits | At Initial | Circuits | At Initial | | Insertion (Max.) | Withdrawal (Min.) | Insertion (Max.) | Withdrawal (Min.) | | 03 | 2.50 | 3.00 | 10 | 6.00 | 4.50 | | 04 | 3.00 | 3.00 | 11 | 6.50 | 4.50 | | 05 | 3.50 | 3.00 | 12 | 7.00 | 4.50 | | 06 | 4.00 | 3.00 | 13 | 7.50 | 5.00 | | 07 | 4.50 | 3.50 | 14 | 8.00 | 5.00 | | 08 | 5.00 | 4.00 | 15 | 8.00 | 5.00 | | 09 | 5.50 | 4.00 | 16 | 8.00 | 5.50 |
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